A3P060-1FG144T

The A3P060-1FG144T is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a mid-density programmable logic fabric with 1536 logic elements, 18,432 bits of embedded RAM and 96 user I/O in a compact 144-LBGA package.

Designed and qualified for automotive applications (AEC‑Q100) and specified over a wide operating temperature range, this device targets systems that require reliable, reprogrammable logic, flexible I/O and robust operation across -40 °C to 125 °C.

Key Features

• Logic Capacity — 1536 logic elements (cells) for implementing combinational and sequential logic functions across mid-density designs.
• Embedded Memory — 18,432 bits of on-chip RAM to support buffering, small lookup tables and state storage without external memory.
• I/O — 96 user I/O pins to interface with sensors, peripherals and external logic in compact system layouts.
• Power — Single supply voltage range of 1.425 V to 1.575 V, enabling consistent core power requirements.
• Package — 144-LBGA (144‑FPBGA 13×13) surface-mount package for space-efficient board integration.
• Automotive Qualification — AEC‑Q100 qualification and an operating temperature range of -40 °C to 125 °C for automotive-grade reliability.
• Mounting Type — Surface mount for automated PCB assembly processes.
• Regulatory — RoHS compliant.

Typical Applications

• Automotive Control Systems — Suitable for vehicle control and interface functions where AEC‑Q100 qualification and wide temperature tolerance are required.
• Sensor and Actuator Interfaces — Use the device’s I/O and embedded RAM for signal conditioning, protocol bridging and sensor data handling in constrained spaces.
• Embedded Logic Integration — Implement mid-density glue logic, state machines and timing-critical control functions to reduce external component count.

Unique Advantages

• AEC‑Q100 Qualified: Built to meet automotive qualification requirements, supporting deployment in temperature-critical vehicle environments.
• Compact, High-Function Density: 1536 logic elements and 96 I/O in a 144-LBGA package optimize board space while delivering flexible logic capability.
• On-Chip RAM: 18,432 bits of embedded memory reduce dependence on external memory for small data buffering and LUT requirements.
• Consistent Core Supply: Narrow supply range (1.425 V–1.575 V) simplifies power delivery design for the FPGA core.
• Wide Operating Range: Specified operation from -40 °C to 125 °C supports deployments across harsh thermal environments.
• Surface-Mount Packaging: 144-LBGA package supports automated assembly and compact system designs.

Why Choose A3P060-1FG144T?

The A3P060-1FG144T combines mid-density programmable logic with automotive-grade qualification and a compact LBGA footprint, making it well suited for designs that require reliable reprogrammable logic in temperature-challenging environments. Its balance of logic elements, embedded RAM and abundant I/O delivers flexible integration for control, interfacing and glue-logic tasks while keeping BOM complexity low.

Engineers and procurement teams seeking a qualified, space-efficient FPGA for automotive and similarly demanding embedded applications will find the A3P060-1FG144T a practical choice for scalable, robust designs backed by Microchip Technology’s ProASIC3 family lineage.

Request a quote or submit a purchasing inquiry today to receive pricing and availability information for the A3P060-1FG144T.