A3P030-VQG100I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 77 100-TQFP |
|---|---|
| Quantity | 58 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 77 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 768 | ||
| Number of Gates | 30000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A3P030-VQG100I – ProASIC3 FPGA, 77 I/O, 100-TQFP
The A3P030-VQG100I is a ProASIC3 Field Programmable Gate Array (FPGA) in a 100-pin TQFP package from Microchip Technology. It delivers 768 logic elements and 30,000 gates of programmable digital logic for implementing custom combinational and sequential functions.
Built and specified for industrial applications, the device provides 77 user I/O pins, a 1.425 V to 1.575 V supply range, and an operating temperature range of −40 °C to 100 °C, making it suited to embedded control, interface bridging, and industrial automation designs that require moderate logic density in a compact surface-mount package.
Key Features
- Core / Logic 768 logic elements delivering approximately 30,000 gates of programmable logic capacity for custom digital implementations.
- Memory Total on-chip RAM is 0 bits; designs requiring memory will use external RAM resources.
- I/O 77 user I/O pins to support a variety of digital interfaces and signal routing on the board.
- Power Single supply voltage range of 1.425 V to 1.575 V for core operation.
- Package & Mounting 100-TQFP package case (supplier device package also listed as 100-VQFP 14×14) in a surface-mount form factor for compact PCB layouts.
- Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C.
- Compliance RoHS-compliant construction for regulatory and assembly considerations.
Typical Applications
- Industrial Control Systems Implement machine control logic, timing, and deterministic decision functions that operate across industrial temperature ranges.
- Interface Bridging Provide custom protocol translation and signal conditioning between subsystems using available I/O resources.
- Embedded System Glue Logic Consolidate discrete logic and address/control decoding into a single programmable device to reduce BOM and PCB complexity.
- Prototyping and Low-to-Medium Density Designs Evaluate and validate digital functions where moderate logic capacity and a compact TQFP footprint are preferred.
Unique Advantages
- Moderate Logic Density: 768 logic elements and 30,000 gates provide a clear capacity target for mid-range digital functions without over-sizing the design.
- Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in demanding environmental conditions.
- Compact, Surface-Mount Package: 100-pin TQFP/VQFP packaging enables high-density PCB layouts and standard SMT assembly processes.
- Flexible I/O Count: 77 user I/O pins allow diverse interfacing options for peripheral devices and board-level signal routing.
- RoHS Compliance: Conforms to RoHS requirements to simplify regulatory compliance for manufactured products.
- Low-Voltage Core Compatibility: Narrow 1.425 V–1.575 V supply window supports designs using low-voltage core domains.
Why Choose A3P030-VQG100I?
The A3P030-VQG100I positions itself as a compact, industrial-grade FPGA option for designs that require moderate programmable logic capacity and reliable operation across a wide temperature range. Its combination of 768 logic elements, 77 I/Os, and a 100-pin surface-mount package makes it a practical choice for embedded control, protocol bridging, and mid-density digital integration.
Engineers and procurement teams seeking a Microchip Technology ProASIC3 device will find this part suited to applications where package size, I/O flexibility, and industrial temperature capability are key selection criteria. The specified electrical and environmental parameters support consistent, long-term integration into production designs.
Request a quote or submit an inquiry for pricing and availability of the A3P030-VQG100I to receive detailed ordering information and lead-time guidance.

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