A3P030-QNG68I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 49 68-VFQFN Exposed Pad |
|---|---|
| Quantity | 84 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 68-QFN (8x8) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 68-VFQFN Exposed Pad | Number of I/O | 49 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 768 | ||
| Number of Gates | 30000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A3P030-QNG68I – ProASIC3 Field Programmable Gate Array (FPGA) IC, 49 I/O, 68-VFQFN Exposed Pad
The A3P030-QNG68I is a ProASIC3 family field programmable gate array (FPGA) from Microchip Technology designed for industrial applications. It provides a compact, surface-mount FPGA option with a defined logic capacity and I/O count for embedded control and interface tasks.
With 768 logic elements (approximately 30,000 gates), 49 user I/Os, an exposed-pad 68-VFQFN (8×8) package, and an operating temperature range of −40°C to 100°C, this device targets designs that require moderate programmable logic density in a small footprint and industrial temperature capability.
Key Features
- Core Logic 768 logic elements (listed) providing approximately 30,000 gates of combinational logic capacity for glue logic and control functions.
- I/O 49 user I/Os to interface with peripheral devices, sensors, and external logic.
- Memory Total on-chip RAM reported as 0 bits (no embedded RAM bits listed in the provided data).
- Power Defined core/primary voltage supply range of 1.425 V to 1.575 V for system power planning and regulator selection.
- Package & Mounting 68-VFQFN exposed pad package (supplier device package: 68-QFN, 8×8) in a surface-mount form factor.
- Temperature & Grade Industrial grade with an operating temperature range from −40°C to 100°C suitable for temperature-demanding environments.
- Compliance RoHS compliant for environmentally constrained designs.
Typical Applications
- Industrial control Programmable logic and I/O handling in automation equipment where industrial temperature operation and moderate logic density are required.
- Embedded interface and glue logic Signal conditioning, protocol bridging, and peripheral interfacing using the device's 49 I/Os and logic elements.
- Communications and I/O expansion Implementing custom I/O functions and small-scale protocol handling in compact board designs.
- Compact system designs Use in space-constrained applications that benefit from an 8×8 QFN footprint with an exposed pad.
Unique Advantages
- Right-sized logic capacity: 768 logic elements (~30,000 gates) offers a balance of programmable resources for moderate-complexity designs without excess overhead.
- Moderate I/O count: 49 user I/Os provide flexible connectivity to peripherals, sensors, and external devices.
- Industrial temperature rating: Specified operation from −40°C to 100°C supports deployment in temperature-demanding environments.
- Compact, industry-standard package: 68-VFQFN (68-QFN, 8×8) surface-mount package with exposed pad for board-level integration in tight layouts.
- Controlled supply requirements: Narrow voltage supply range (1.425 V to 1.575 V) simplifies power-supply selection and voltage regulation planning.
- Environmental compliance: RoHS compliant to meet common environmental requirements.
Why Choose A3P030-QNG68I?
The A3P030-QNG68I is positioned for designers seeking a compact, industrial-grade FPGA option with moderate logic capacity and a practical number of I/Os. Its defined electrical and thermal characteristics make it suitable for embedded systems, industrial control, and compact interface applications where package size and operating temperature range are important.
As a Microchip Technology device, it provides a clear specification set—logic elements, I/O count, supply voltage range, package, and operating temperature—that helps engineers plan board layout, power, and thermal management for robust, repeatable designs.
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