A3P030-QNG68I

IC FPGA 49 I/O 68QFN
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 49 68-VFQFN Exposed Pad

Quantity 84 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package68-QFN (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case68-VFQFN Exposed PadNumber of I/O49Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells768
Number of Gates30000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A3P030-QNG68I – ProASIC3 Field Programmable Gate Array (FPGA) IC, 49 I/O, 68-VFQFN Exposed Pad

The A3P030-QNG68I is a ProASIC3 family field programmable gate array (FPGA) from Microchip Technology designed for industrial applications. It provides a compact, surface-mount FPGA option with a defined logic capacity and I/O count for embedded control and interface tasks.

With 768 logic elements (approximately 30,000 gates), 49 user I/Os, an exposed-pad 68-VFQFN (8×8) package, and an operating temperature range of −40°C to 100°C, this device targets designs that require moderate programmable logic density in a small footprint and industrial temperature capability.

Key Features

  • Core Logic  768 logic elements (listed) providing approximately 30,000 gates of combinational logic capacity for glue logic and control functions.
  • I/O  49 user I/Os to interface with peripheral devices, sensors, and external logic.
  • Memory  Total on-chip RAM reported as 0 bits (no embedded RAM bits listed in the provided data).
  • Power  Defined core/primary voltage supply range of 1.425 V to 1.575 V for system power planning and regulator selection.
  • Package & Mounting  68-VFQFN exposed pad package (supplier device package: 68-QFN, 8×8) in a surface-mount form factor.
  • Temperature & Grade  Industrial grade with an operating temperature range from −40°C to 100°C suitable for temperature-demanding environments.
  • Compliance  RoHS compliant for environmentally constrained designs.

Typical Applications

  • Industrial control  Programmable logic and I/O handling in automation equipment where industrial temperature operation and moderate logic density are required.
  • Embedded interface and glue logic  Signal conditioning, protocol bridging, and peripheral interfacing using the device's 49 I/Os and logic elements.
  • Communications and I/O expansion  Implementing custom I/O functions and small-scale protocol handling in compact board designs.
  • Compact system designs  Use in space-constrained applications that benefit from an 8×8 QFN footprint with an exposed pad.

Unique Advantages

  • Right-sized logic capacity: 768 logic elements (~30,000 gates) offers a balance of programmable resources for moderate-complexity designs without excess overhead.
  • Moderate I/O count: 49 user I/Os provide flexible connectivity to peripherals, sensors, and external devices.
  • Industrial temperature rating: Specified operation from −40°C to 100°C supports deployment in temperature-demanding environments.
  • Compact, industry-standard package: 68-VFQFN (68-QFN, 8×8) surface-mount package with exposed pad for board-level integration in tight layouts.
  • Controlled supply requirements: Narrow voltage supply range (1.425 V to 1.575 V) simplifies power-supply selection and voltage regulation planning.
  • Environmental compliance: RoHS compliant to meet common environmental requirements.

Why Choose A3P030-QNG68I?

The A3P030-QNG68I is positioned for designers seeking a compact, industrial-grade FPGA option with moderate logic capacity and a practical number of I/Os. Its defined electrical and thermal characteristics make it suitable for embedded systems, industrial control, and compact interface applications where package size and operating temperature range are important.

As a Microchip Technology device, it provides a clear specification set—logic elements, I/O count, supply voltage range, package, and operating temperature—that helps engineers plan board layout, power, and thermal management for robust, repeatable designs.

Request a quote or submit a quote request for A3P030-QNG68I to obtain pricing, lead time, and availability information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up