A3P030-QNG68

IC FPGA 49 I/O 68QFN
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 49 68-VFQFN Exposed Pad

Quantity 578 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package68-QFN (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case68-VFQFN Exposed PadNumber of I/O49Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells768
Number of Gates30000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A3P030-QNG68 – ProASIC3 Flash FPGA, 768 Logic Elements, 68‑VFQFN

The A3P030-QNG68 is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology. It provides a moderate logic capacity with 768 logic elements and approximately 30,000 gates in a compact 68‑VFQFN exposed‑pad package.

Designed as a commercial‑grade, surface‑mount programmable device, the part offers 49 I/O pins, a defined supply voltage range of 1.425 V to 1.575 V, and an operating temperature range of 0 °C to 85 °C—attributes that support compact, board‑level programmable logic implementations.

Key Features

  • Logic Elements 768 logic elements providing approximately 30,000 gates for implementing combinational and sequential logic functions.
  • I/O Capacity 49 user I/O pins to interface with peripherals, sensors, and other digital subsystems.
  • On‑chip Memory No on‑chip RAM bits specified for this device.
  • Supply Voltage Operates from 1.425 V to 1.575 V, enabling designs that require a specific core supply window.
  • Package and Mounting 68‑VFQFN exposed pad (supplier package: 68‑QFN, 8×8); surface‑mount package suitable for compact PCB layouts and thermal grounding via exposed pad.
  • Operating Range Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Regulatory RoHS‑compliant for compliance with lead‑free assembly requirements.

Typical Applications

  • Compact programmable logic Use where a 768‑logic‑element FPGA footprint and 49 I/Os meet integration and board‑space constraints.
  • Glue logic and I/O consolidation Integrate discrete logic functions and consolidate peripheral interfaces within a single device.
  • Small form‑factor designs Suitable for applications needing a low‑profile QFN package with an exposed pad for board mounting and thermal conduction.

Unique Advantages

  • Right‑sized logic capacity: 768 logic elements and 30,000 gates provide the scale for moderate complexity designs without excess resource overhead.
  • Defined supply window: The 1.425 V to 1.575 V supply range gives deterministic power requirements for system power budgeting.
  • Compact, serviceable package: 68‑VFQFN exposed‑pad package offers a compact footprint and a thermal/ground reference for board layout.
  • Commercial availability: Commercial grade operation (0 °C to 85 °C) and RoHS compliance support mainstream embedded and consumer applications.
  • Clear pin count: 49 I/Os allow straightforward connection to peripherals and neighboring ICs without guesswork on available I/O.

Why Choose A3P030-QNG68?

The A3P030-QNG68 positions itself as a compact, commercial‑grade ProASIC3 FPGA option for designs that require moderate programmable logic capacity and a small QFN footprint. Its combination of 768 logic elements, defined supply voltage range, and 49 I/O pins makes it well suited to designs that demand predictable power requirements and a compact package.

For engineers and buyers seeking a RoHS‑compliant, surface‑mount FPGA with clear electrical and mechanical parameters, this part offers an integrated solution that simplifies board‑level logic consolidation while keeping package and thermal considerations manageable.

Request a quote or submit a purchasing inquiry for the A3P030-QNG68 to receive pricing and availability information tailored to your project requirements.

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