A3P030-QNG48I

The A3P030-QNG48I is a ProASIC3 Field Programmable Gate Array (FPGA) IC designed for compact, industrial-grade logic integration. It provides 768 logic elements (approximately 30,000 gates) and 34 user I/O in a 48-VFQFN exposed pad package suitable for surface-mount assembly.

With a core supply range of 1.425 V to 1.575 V and an operating temperature range of -40 °C to 100 °C, this device targets applications that require a small-footprint FPGA with industrial temperature capability and RoHS compliance.

Key Features

• Logic Capacity  768 logic elements (reported) delivering approximately 30,000 gates for implementing custom combinational and sequential logic.
• I/O Count  34 user I/O pins to interface with peripherals, sensors, or external logic devices.
• On-Chip Memory  Total RAM bits: 0 — this device does not include embedded RAM.
• Power  Core voltage supply range of 1.425 V to 1.575 V for consistent core operation.
• Package & Mounting  48-VFQFN exposed pad, supplied as 48-QFN (6×6) for surface-mount PCB assembly and thermal conduction through the exposed pad.
• Temperature & Grade  Industrial grade device rated for operation from -40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Implement custom control logic and I/O interfacing in industrial automation systems where the -40 °C to 100 °C rating is required.
• Sensor and Signal Conditioning  Handle sensor interfacing and signal preprocessing using available I/O while conserving board space with the 48-QFN package.
• Embedded Logic Functions  Replace glue logic or small CPLD functions with 768 logic elements to consolidate discrete components.
• Communication Interfaces  Implement simple protocol bridging and custom interface logic using the device's I/O resources and logic capacity.

Unique Advantages

• Compact, thermally capable package: The 48-VFQFN exposed pad (48-QFN, 6×6) reduces PCB footprint and supports thermal management for dense board layouts.
• Industrial temperature rating: Operation from -40 °C to 100 °C supports deployment in environments with wider temperature swings.
• Right-sized logic capacity: 768 logic elements and roughly 30,000 gates provide a balance of density for mid-range control and interface tasks without excess complexity.
• Surface-mount assembly friendly: QFN package and exposed pad simplify automated solder processes and mechanical stability on production lines.
• RoHS compliant: Meets environmental compliance requirements for regulated markets and assembly policies.

Why Choose A3P030-QNG48I?

The A3P030-QNG48I positions itself as a compact, industrial-grade FPGA option for designers needing modest logic capacity, a moderate number of I/O, and a small footprint. Its 768 logic elements and approximately 30,000 gates are well suited to replace discrete logic networks or implement dedicated control and interface functions.

With a narrow core supply range and an exposed-pad QFN package, this device provides predictable electrical and thermal characteristics for production designs that prioritize board space, thermal conduction, and operation across -40 °C to 100 °C. RoHS compliance further supports regulatory requirements for modern electronic assemblies.

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