A3P060-1TQG144I

The A3P060-1TQG144I is a ProASIC3 family FPGA from Microchip Technology, offered in a 144-LQFP surface-mount package. It provides a mid-range combination of logic capacity, on-chip RAM, and I/O count targeted at industrial applications requiring configurable digital logic.

With 1,536 logic elements, 18,432 bits of embedded RAM, 91 I/O pins and a specified operating temperature range of -40 °C to 100 °C, this device is suited for designs that need moderate logic density, low-voltage operation and industrial-temperature operation.

Key Features

• Logic Capacity — 1,536 logic elements (approximately as provided) and a total gate count of 60,000 for implementing glue logic, finite state machines and moderate-density custom logic.
• Embedded Memory — Approximately 0.018 Mbits (18,432 bits) of on-chip RAM to support small data buffers, FIFOs or lookup tables without external memory.
• I/O Resources — 91 general-purpose I/O pins to interface with sensors, peripherals and external logic within the same 144-LQFP footprint.
• Power — Core voltage supply range of 1.425 V to 1.575 V to match low-voltage system rails and minimize power delivery complexity.
• Package & Mounting — 144-LQFP (surface mount) package, supplier device package listed as 144-TQFP (20×20), providing a compact footprint for PCB designs.
• Industrial Temperature Rating — Specified operating temperature from -40 °C to 100 °C for deployment in industrial environments.
• Surface-Mount Construction — Designed for standard surface-mount assembly processes and integration into automated production flows.

Typical Applications

• Industrial Control and Automation — Industrial-grade operating temperature and a balance of logic and I/O make this device suitable for control logic, protocol bridging and state-machine tasks in factory equipment.
• I/O Expansion and Glue Logic — 91 I/O pins enable use as a configurable interface hub to translate, buffer or aggregate signals between subsystems.
• Embedded System Integration — Moderate logic capacity and on-chip RAM support integration of custom accelerators, peripheral controllers or timing-critical glue directly in the FPGA fabric.

Unique Advantages

• Balanced Logic and Memory: Combines 1,536 logic elements with 18,432 bits of embedded RAM for designs that require both combinational logic and small on-chip storage.
• Significant I/O Count: 91 I/O pins in a 144-LQFP package reduce the need for additional interface ICs, simplifying PCB routing and BOM.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to meet environmental demands of industrial deployments.
• Low-Voltage Core: Operates at a core voltage between 1.425 V and 1.575 V to align with low-voltage system power rails.
• Compact Surface-Mount Package: 144-LQFP surface-mount form factor supports high-density board layouts and automated assembly.

Why Choose A3P060-1TQG144I?

The A3P060-1TQG144I delivers a practical mix of logic density, on-chip memory and I/O resources in an industrial-grade, surface-mount package from Microchip Technology. It is well suited to engineers building embedded systems and industrial controls that require configurable logic, dependable temperature performance and a compact footprint.

For projects requiring medium-density programmable logic with a clear set of electrical and environmental specifications—1,536 logic elements, 18,432 bits of embedded RAM, 91 I/Os, 1.425–1.575 V core voltage and -40 °C to 100 °C operating range—this device offers a straightforward integration path and predictable system behavior.

Request a quote or submit an inquiry for pricing and availability to evaluate the A3P060-1TQG144I for your next design project.