A3P060-1VQ100T
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 71 18432 100-TQFP |
|---|---|
| Quantity | 775 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 71 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 1536 | ||
| Number of Gates | 60000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 18432 |
Overview of A3P060-1VQ100T – ProASIC3 Field Programmable Gate Array (FPGA) IC, 100-TQFP
The A3P060-1VQ100T is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology designed for automotive-grade embedded logic. It provides mid-density programmable logic, on-chip memory, and a substantial I/O count in a surface-mount 100-TQFP package.
With AEC-Q100 qualification, a wide operating temperature range and a low-voltage supply window, this device addresses automotive and other applications that require reliable operation across harsh environments while maintaining compact board-level integration.
Key Features
- Logic Capacity 1536 logic elements providing approximately 60,000 gates of programmable logic to implement custom control, glue logic, and data-path functions.
- Embedded Memory Approximately 18,432 bits of on-chip RAM for buffering, small lookup tables, and temporary data storage within the FPGA fabric.
- I/O and Connectivity 71 I/O pins to support multiple peripheral interfaces and interconnections on modern embedded PCBs.
- Package and Mounting 100-TQFP surface-mount package (supplier device package: 100-VQFP, 14×14 mm) for straightforward PCB assembly and dense board layouts.
- Power Low-voltage operation with a supply range of 1.425 V to 1.575 V to match low-voltage system domains.
- Temperature Range Rated for operation from −40 °C to 125 °C to meet wide-temperature deployment requirements.
- Automotive Qualification Automotive grade with AEC‑Q100 qualification for designs requiring validated automotive reliability.
- Environmental Compliance RoHS compliant to meet lead-free manufacturing and environmental requirements.
Typical Applications
- Automotive control systems Applicable where AEC‑Q100 qualification and operation from −40 °C to 125 °C are required for vehicle electronics logic functions.
- In-vehicle sensor and interface processing 71 I/O and embedded memory enable aggregation, preprocessing, and protocol interfacing for sensors and peripheral modules.
- Space-constrained embedded designs 100-TQFP surface-mount packaging provides a compact footprint for board-level integration in constrained enclosures.
Unique Advantages
- AEC-Q100 qualified Designed and qualified for automotive applications where industry-recognized device qualification is required.
- Balanced mid-density logic 1536 logic elements and ~60,000 gates deliver sufficient programmable resources for many control and interface implementations without excessive complexity.
- On-chip RAM Approximately 18,432 bits of embedded memory help reduce external memory needs for small buffers and lookup tables.
- Ample I/O count 71 I/O pins provide flexibility to connect sensors, actuators, and communication lines directly to the FPGA fabric.
- Wide operating range 1.425–1.575 V supply and −40 °C to 125 °C operating range support robust operation across automotive temperature and voltage domains.
- Compact package 100-TQFP (14×14 mm) surface-mount package simplifies assembly for compact PCB designs.
Why Choose A3P060-1VQ100T?
The A3P060-1VQ100T positions itself as a reliable, mid-density FPGA option for designs that require automotive qualification, moderate programmable logic capacity, and a compact surface-mount package. Its combination of 1536 logic elements, on-chip RAM, 71 I/O and AEC‑Q100 qualification makes it suitable for embedded automotive logic, interface bridging, and other applications demanding extended temperature and proven device qualification.
Backed by Microchip Technology, this device offers a straightforward way to integrate programmable logic into designs where board space, temperature resilience, and compliance matter, while keeping power-domain integration simple with a defined low-voltage supply range.
If you would like pricing, availability, or a formal quote for the A3P060-1VQ100T, submit a request and our team will respond with the information you need.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D