A3P060-2FG144

IC FPGA 96 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 96 18432 144-LBGA

Quantity 310 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LBGANumber of I/O96Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells1536
Number of Gates60000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of A3P060-2FG144 – ProASIC3 Field Programmable Gate Array (FPGA) IC 96 18432 144-LBGA

The A3P060-2FG144 is a ProASIC3 family FPGA from Microchip Technology designed for mid-density programmable logic needs. It combines 1,536 logic elements, approximately 18,432 bits of on-chip RAM and 60,000 equivalent gates with up to 96 general-purpose I/O to support embedded control, interface consolidation and custom logic functions in commercial applications.

Packaged in a 144-LBGA (144-FPBGA 13×13) surface-mount package, the device is specified for a supply range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and targeted at designs that require a compact, predictable programmable logic solution.

Key Features

  • Core and Logic 1,536 logic elements providing up to 60,000 equivalent gates for mid-density logic integration and custom combinational/sequential functions.
  • Embedded Memory 18,432 bits of on-chip RAM for small buffers, FIFOs and state storage without external memory.
  • I/O Capacity 96 general-purpose I/O pins to interface with peripherals, sensors and external controllers.
  • Power Defined supply voltage range of 1.425 V to 1.575 V to support predictable power budgeting and supply design.
  • Package & Mounting 144-LBGA (144-FPBGA 13×13) surface-mount package for compact, high-density PCB layouts.
  • Operating Range & Grade Commercial grade device specified for 0 °C to 85 °C operation.
  • Environmental Compliance RoHS compliant to assist with regulatory and environmental requirements.

Typical Applications

  • Embedded control: Implement control logic, state machines and small processing blocks for consumer and industrial equipment.
  • Interface bridging: Consolidate and translate multiple peripheral interfaces using available I/O and programmable logic.
  • Instrument and test equipment: Provide custom signal routing, timing control and data buffering in compact test systems.
  • Prototyping and evaluation: Validate mid-density logic partitioning and I/O architectures before production development.

Unique Advantages

  • Compact mid‑density integration: 1,536 logic elements and 96 I/O in a 144‑LBGA package reduce board footprint while supporting moderate design complexity.
  • On‑chip memory for control tasks: 18,432 bits of RAM enable local buffering and state retention without external memory components.
  • Predictable power requirements: Narrow supply range (1.425–1.575 V) simplifies power supply design and decoupling strategies.
  • Commercial temperature rating: Specified 0 °C to 85 °C operation for mainstream electronic products.
  • RoHS compliant: Meets RoHS requirements to ease environmental compliance for product launches.
  • Surface-mount 144-LBGA: High-density packaging supports automated PCB assembly and compact system designs.

Why Choose A3P060-2FG144?

The A3P060-2FG144 offers a balanced combination of logic capacity, on-chip memory and I/O density in a compact 144-LBGA package, making it suitable for commercial embedded designs that require moderate programmable logic resources. As a Microchip Technology FPGA, it provides predictable electrical and thermal parameters—1.425 V to 1.575 V supply and 0 °C to 85 °C operating range—together with RoHS compliance for streamlined product development.

This device is well suited to designers and teams building mid-complexity control, interface and signal-processing tasks who need a compact, surface-mount FPGA with defined power and temperature characteristics and a reliable manufacturer backing.

Request a quote or submit a pricing and availability inquiry to obtain lead-time and ordering details for the A3P060-2FG144.

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