A3P060-2FGG144

The A3P060-2FGG144 is a ProASIC3 family Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial electronic designs. It provides a balanced combination of logic capacity, on-chip memory, and I/O for board-level integration in space-constrained layouts.

With 1,536 logic elements, approximately 60,000 gates and 18,432 bits of embedded RAM, this surface-mount FPGA targets applications that require moderate logic density, up to 96 I/O signals, and a compact 144-LBGA footprint.

Key Features

• Core / Logic  1,536 logic elements delivering roughly 60,000 gates of programmable logic capacity for implementing custom combinational and sequential logic functions.
• On-Chip Memory  18,432 bits of embedded RAM for temporary data storage, buffering and small lookup tables directly within the FPGA fabric.
• I/O Capability  Up to 96 general-purpose I/O pins to support multiple external interfaces and parallel or serial device connections.
• Power  Core voltage supply specified at 1.425 V to 1.575 V, enabling predictable power planning for board designs.
• Package & Mounting  144-LBGA package (supplier device package: 144-FPBGA 13×13) in a surface-mount format for compact board-level integration.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C to match typical commercial electronics environments.
• Compliance  RoHS compliant to support environmentally regulated designs and assembly processes.

Typical Applications

• Commercial Embedded Systems  Implement control logic and custom state machines where moderate logic density and on-chip RAM are required.
• I/O Expansion and Interface Logic  Use the 96 I/O pins to glue together peripheral interfaces or to implement protocol translation between subsystems.
• Compact Board-Level Integration  The 144-LBGA surface-mount package enables FPGA integration in size-constrained PCBs and module designs.

Unique Advantages

• Balanced Logic Density:  1,536 logic elements and ~60,000 gates provide sufficient capacity for a wide range of commercial logic tasks without over-sizing the device.
• On-Device RAM:  18,432 bits of embedded RAM reduce dependence on external memory for small buffers and LUTs, simplifying BOM and layout.
• Generous I/O Count:  96 I/O pins allow flexible interfacing to sensors, controllers, and peripherals without additional IO expanders.
• Compact, Surface-Mount Package:  The 144-LBGA (144-FPBGA 13×13) footprint supports high-density PCB designs and module-level implementations.
• Commercial Temperature and RoHS Compliance:  Rated for 0 °C to 85 °C and RoHS compliant, suitable for mainstream commercial product lines and assemblies.
• Predictable Power Envelope:  A defined supply range of 1.425 V to 1.575 V aids in reliable power-supply design and system integration.

Why Choose A3P060-2FGG144?

The A3P060-2FGG144 delivers a pragmatic mix of logic resources, on-chip memory and I/O density in a compact LBGA package targeted at commercial embedded designs. Its defined supply range and commercial operating temperature make it straightforward to integrate into standard board designs where predictability and footprint are priorities.

This part is suitable for engineers seeking a moderate-capacity FPGA solution for interface logic, control functions, and compact system integration, providing long-term value through a combination of integration, RoHS compliance, and a package optimized for surface-mount assembly.

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