A3P060-2TQG144
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 91 18432 144-LQFP |
|---|---|
| Quantity | 978 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 91 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 1536 | ||
| Number of Gates | 60000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of A3P060-2TQG144 – ProASIC3 FPGA, 91 I/O, 18,432 bits RAM, 144-LQFP
The A3P060-2TQG144 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It combines a programmable logic core with embedded memory and a moderate I/O count in a compact 144-pin surface-mount package for commercial applications.
With 1,536 logic elements (approximately 60,000 gates), roughly 18,432 bits of on-chip RAM and 91 I/O, this device is intended for commercial embedded designs where integration, predictable supply requirements, and RoHS compliance are important design considerations.
Key Features
- Logic Core — 1,536 logic elements (LABs/CLBs) providing implementation capacity of approximately 60,000 gates for custom digital functions.
- Embedded Memory — Approximately 18,432 bits of on-chip RAM to support small buffers, state machines, and register storage.
- I/O — 91 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
- Supply Voltage — Single supply operation with a specified voltage range of 1.425 V to 1.575 V for core power planning.
- Package & Mounting — 144-LQFP package case; supplier device package listed as 144-TQFP (20×20). Surface mount design suitable for standard PCB assembly.
- Operating Conditions — Commercial grade device rated for 0 °C to 85 °C operating temperature.
- Environmental Compliance — RoHS compliant for restricted substance requirements.
Typical Applications
- Commercial embedded systems — Implements custom control logic, protocol bridging, or peripheral interfaces where a compact FPGA solution is required.
- Consumer electronics — Provides programmable logic and I/O flexibility for feature customization and iterative product development in consumer devices.
- Prototyping and development — Useful for early-stage hardware validation and proof-of-concept designs that need reconfigurable logic and modest on-chip memory.
Unique Advantages
- Balanced integration: Combines 1,536 logic elements, embedded RAM and 91 I/O in a single device to reduce BOM count and simplify board-level integration.
- Compact package options: 144-LQFP / 144-TQFP (20×20) packaging provides a compact footprint for space-constrained commercial designs.
- Predictable power envelope: Narrow core supply range (1.425–1.575 V) simplifies power-supply design and regulation planning.
- Commercial temperature rating: Specified for 0 °C to 85 °C operation to match typical commercial product lifecycles and deployment environments.
- Regulatory friendliness: RoHS compliance supports designs targeting restricted-substance requirements.
Why Choose A3P060-2TQG144?
The A3P060-2TQG144 positions itself as a compact ProASIC3 FPGA option for commercial embedded designs that require a balance of logic capacity, on-chip memory, and a substantial I/O count in a surface-mount 144-pin package. Its defined supply range and commercial temperature grade make it suitable for mainstream consumer and embedded applications where predictable electrical and environmental characteristics are needed.
Manufactured by Microchip Technology and compliant with RoHS, this device offers an integrated, programmable platform for teams looking to consolidate discrete logic, implement custom interfaces, or accelerate prototyping efforts while maintaining clear specification boundaries for power and thermal design.
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