A3P060-2FGG144I

The A3P060-2FGG144I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for embedded and industrial applications that require medium-density programmable logic. It provides 1,536 logic elements, approximately 60,000 gates and 18,432 bits of on-chip RAM, along with 96 user I/O pins, enabling a compact, integrated programmable solution for control, interface and custom logic functions.

Packaged in a 144-ball LBGA (supplier package: 144-FPBGA, 13×13) and specified for industrial temperature operation, this device targets designs where board space, controlled supply voltage and robust temperature range are key considerations.

Key Features

• Logic Capacity — 1,536 logic elements providing roughly 60,000 gates of programmable logic to implement custom digital functions and state machines.
• Embedded Memory — 18,432 bits of on-chip RAM available for buffering, FIFOs and small lookup tables.
• I/O Count — 96 general-purpose I/O pins to support a variety of peripheral interfaces and signal connections.
• Power Supply — Specified core voltage range of 1.425 V to 1.575 V for predictable power design and regulation.
• Package & Mounting — 144-LBGA package (supplier device package: 144-FPBGA, 13×13) optimized for surface-mount assembly and space-constrained boards.
• Industrial Temperature Grade — Rated for operation from −40°C to 100°C to meet extended temperature requirements in demanding environments.
• RoHS Compliant — Manufactured in compliance with RoHS directives for reduced hazardous substance content.

Typical Applications

• Industrial Control — Use the device’s industrial temperature rating and multiple I/O to implement sensor interfacing, control logic and protocol bridging in factory and process automation equipment.
• Embedded System Glue Logic — Deploy the FPGA to consolidate glue logic, bus interfacing and custom timing functions, reducing component count on compact boards.
• Interface and I/O Expansion — Leverage 96 I/Os and on-chip RAM for protocol adaptation, signal conditioning, and temporary data buffering between subsystems.

Unique Advantages

• Balanced Logic and Memory: 1,536 logic elements paired with 18,432 bits of embedded RAM provide a compact mix of combinational logic and local storage for many mid-range designs.
• Comprehensive I/O Count: Ninety-six user I/Os allow flexible interfacing to peripherals, sensors and external controllers without immediate need for external I/O expanders.
• Industrial Temperature Support: Rated from −40°C to 100°C to help maintain reliable operation in harsh or variable thermal environments.
• Controlled Core Voltage: Narrow supply range (1.425 V–1.575 V) facilitates predictable power-system design and voltage regulation planning.
• Compact Surface-Mount Package: 144-LBGA (144-FPBGA, 13×13) minimizes PCB footprint while supporting automated assembly for volume production.
• RoHS Compliance: Conforms to RoHS requirements for environmentally responsible manufacturing.

Why Choose A3P060-2FGG144I?

The A3P060-2FGG144I positions itself as a practical mid-density ProASIC3 FPGA for designers who need a balance of logic capacity, embedded memory and a sizable I/O count in a compact industrial-grade package. Its specified operating temperature range and controlled core voltage make it suitable for deployed systems that must operate reliably across extended temperature conditions.

This device is well suited to embedded engineers and system integrators building industrial control, interface bridging or compact programmable logic subsystems where board space, predictable power design and extended temperature operation are important selection criteria.

Request a quote or submit a purchase inquiry to evaluate the A3P060-2FGG144I for your next design project.