A3P060-2TQ144I

The A3P060-2TQ144I is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology. It provides 60,000 gates and 1,536 logic elements in a compact 144-pin LQFP package, delivering a reconfigurable hardware building block for embedded and industrial applications.

With approximately 18,432 bits of on-chip RAM, 91 user I/Os, an industrial operating temperature range of −40 °C to 100 °C, and a low-voltage supply range of 1.425 V to 1.575 V, this device is suited to designs that require moderate logic density, reliable operation across a wide temperature span, and flexible I/O connectivity.

Key Features

• Logic Capacity  Provides 60,000 gates and 1,536 logic elements for implementing medium-complexity digital logic and state machines.
• Embedded Memory  Approximately 18,432 bits of on-chip RAM to support local buffering, small FIFOs, and control-state storage.
• I/O and Integration  91 user I/O pins enable multiple peripheral interfaces and board-level connectivity without external expanders.
• Power  Core voltage supply range from 1.425 V to 1.575 V to match low-voltage system designs.
• Package and Mounting  144-LQFP package (supplier device package listed as 144-TQFP, 20×20) in a surface-mount form factor for compact PCB layouts.
• Industrial Grade Temperature  Specified to operate from −40 °C to 100 °C for deployment in industrial environments.
• Compliance  RoHS-compliant construction for regulatory and supply-chain consistency.

Typical Applications

• Industrial Control  Implement control logic, state machines, and custom interfaces for factory automation and process-control equipment operating across wide temperature ranges.
• Embedded Systems  Use as a reconfigurable logic engine for application-specific peripherals, glue logic, and timing-critical functions in embedded devices.
• Sensor and I/O Aggregation  Aggregate and condition signals from multiple sensors or digital peripherals using the device’s 91 I/Os and on-chip memory for buffering.
• Communications Interfaces  Provide protocol handling, signal adaptation, and parallel/serial interface logic in communications and instrumentation systems.

Unique Advantages

• Compact, Surface-Mount Packaging: 144-LQFP/144-TQFP (20×20) package allows dense PCB integration while preserving ample I/O for system connectivity.
• Moderate Logic Density: 60,000 gates and 1,536 logic elements support medium-complexity designs without the overhead of larger FPGAs.
• On-Chip RAM for Local Storage: Approximately 18,432 bits of embedded memory enable local buffering and small data structures without external RAM.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet the environmental demands of industrial deployments.
• Low-Voltage Core Support: Narrow core supply range (1.425 V to 1.575 V) aligns with modern low-voltage system rails.
• Regulatory Compatibility: RoHS compliance supports environmentally conscious manufacturing and distribution requirements.

Why Choose A3P060-2TQ144I?

The A3P060-2TQ144I balances moderate programmable logic capacity with industrial-temperature robustness and a compact surface-mount package. It is positioned for engineers and procurement teams who need a reliable, reconfigurable device for embedded and industrial designs that require up to 60,000 gates, specialized I/O connectivity, and on-chip memory for localized data handling.

Backed by Microchip Technology, this ProASIC3 FPGA provides a practical option for designs that prioritize predictable supply voltage operation, RoHS compliance, and a package format suited to compact PCB layouts—delivering a scalable building block for long-term deployments in demanding environments.

Request a quote or contact sales to discuss availability, lead times, and pricing for the A3P060-2TQ144I. Our team can assist with volume inquiries and technical fit for your project requirements.