A3P060-2FG144I

The A3P060-2FG144I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. This device integrates 1,536 logic elements, 18,432 bits of on-chip RAM and 96 I/O pins in a compact 144-ball BGA footprint, delivering a balanced combination of logic capacity, embedded memory and I/O density.

With an industrial-grade operating range and a defined core supply window, the A3P060-2FG144I is positioned for designs that require reliable, reconfigurable logic with predictable electrical and thermal limits.

Key Features

• Core Logic – 1,536 logic elements (cells) providing 60,000 gates of programmable logic capacity for custom digital functions.
• Embedded Memory – 18,432 bits of on-chip RAM for local buffering, state storage and small lookup tables.
• I/O Count – 96 I/O pins to support multiple external interfaces and peripheral connections.
• Power – Specified supply voltage range of 1.425 V to 1.575 V for the core, enabling defined power planning and supply design.
• Package & Mounting – 144-LBGA package; supplier device package listed as 144-FPBGA (13×13) and intended for surface-mount assembly.
• Temperature & Grade – Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in challenging thermal environments.
• Environmental Compliance – RoHS compliant.

Typical Applications

• Industrial Control – The industrial grade rating and −40 °C to 100 °C operating range make this FPGA suitable for factory automation and machine-control logic where environmental robustness is required.
• Embedded I/O Aggregation – With 96 I/O pins and on-chip RAM, the device can consolidate peripheral interfaces and local buffering in compact systems.
• Custom Logic Acceleration – 1,536 logic elements and 60,000 gates enable implementation of custom datapaths, state machines and glue logic for application-specific processing.

Unique Advantages

• Balanced integration: Combines a moderate logic capacity (60k gates) with 18,432 bits of embedded RAM and 96 I/O to address a wide range of mid-density applications without excessive board-level complexity.
• Predictable power envelope: Defined core voltage range (1.425–1.575 V) simplifies power supply selection and thermal planning in constrained designs.
• Industrial temperature capability: Rated from −40 °C to 100 °C, supporting deployments where extended temperature tolerance is necessary.
• Compact BGA footprint: 144-ball BGA (144-FPBGA, 13×13) packaging supports high-density board layouts while preserving routing efficiency.
• Environmentally compliant: RoHS compliance supports regulatory and manufacturing requirements.

Why Choose A3P060-2FG144I?

The A3P060-2FG144I delivers a practical combination of logic, memory and I/O density in a compact industrial-grade package. Its defined supply voltage and temperature specifications make it straightforward to plan for power and thermal margins in production systems.

This part is well suited for engineers designing mid-density embedded systems that require reconfigurable logic, local memory and a substantial number of I/O pins within a compact BGA footprint, offering a reliable platform backed by Microchip Technology.

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