A3P125-1VQG100
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 71 36864 100-TQFP |
|---|---|
| Quantity | 1,038 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 71 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3P125-1VQG100 – ProASIC3 Field Programmable Gate Array (FPGA) IC 71 36864 100-TQFP
The A3P125-1VQG100 is a ProASIC3 field-programmable gate array from Microchip Technology. It provides a programmable logic fabric with 3,072 logic elements and a gate count of 125,000, combined with on-chip RAM and a substantial I/O complement.
Configured in a 100-TQFP (14×14) surface-mount package, the device targets commercial applications that require configurable digital logic with defined supply and thermal limits: 1.425 V to 1.575 V supply range and an operating temperature range of 0 °C to 85 °C.
Key Features
- Core Logic 3,072 logic elements delivering a total of 125,000 gates for implementing custom digital functions.
- Embedded Memory 36,864 bits of on-chip RAM for buffering, state storage, and small data structures.
- I/O Capacity 71 user I/O pins to support multiple interfaces and external peripherals.
- Package and Mounting 100-TQFP (14×14) surface-mount package for compact board-level integration.
- Power Nominal voltage supply range of 1.425 V to 1.575 V to match system power rails.
- Commercial Grade & Compliance Rated for commercial temperature range (0 °C to 85 °C) and RoHS compliant.
Typical Applications
- Custom digital logic implementations — Use the 3,072 logic elements to realize application-specific state machines, sequencers, and datapaths.
- I/O-intensive interface bridging — With 71 I/O pins, implement glue logic and protocol translation between system components.
- Embedded control and monitoring — On-chip RAM and programmable logic enable compact control functions and real-time decision logic.
- Prototyping and low- to mid-volume production — Flexible FPGA-based designs that benefit from reprogrammability during development and deployment.
Unique Advantages
- Balanced logic and memory resources: 3,072 logic elements paired with 36,864 bits of RAM offer a practical mix for many mid-range programmable tasks.
- Substantial I/O count: 71 I/O pins simplify integration with multiple peripherals without immediate need for external expanders.
- Standard surface-mount package: 100-TQFP (14×14) supports compact PCB layouts and widely available assembly processes.
- Commercial temperature rating: Specified operation from 0 °C to 85 °C aligns the device with typical commercial applications.
- RoHS compliant: Meets environmental restriction requirements for lead-free assembly and regulatory conformity.
Why Choose A3P125-1VQG100?
The A3P125-1VQG100 positions itself as a commercially rated, reprogrammable logic device that combines a clear set of resources—3,072 logic elements, roughly 36.9 kbits of embedded RAM, 71 I/O pins, and 125,000 gates—in a compact 100-TQFP package. Its defined supply range (1.425 V–1.575 V) and temperature rating (0 °C–85 °C) make it suitable for mainstream electronic designs that require configurable logic with predictable electrical and thermal envelopes.
Designed by Microchip Technology, the device is a fit for engineers and teams needing a mid-range FPGA option for custom logic, interface bridging, and embedded control tasks where reprogrammability, package density, and RoHS compliance matter.
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