A3P125-2FG144

The A3P125-2FG144 is a Microchip Technology ProASIC3 flash-based FPGA offered in a 144-LBGA package. It provides 3,072 logic elements, 36,864 bits of embedded RAM, and 97 user I/Os for implementing custom digital logic in commercial electronic designs.

Designed for surface-mount board assembly and operation across a commercial temperature range (0 °C to 85 °C), this device targets applications that require mid-density programmable logic with on-chip memory and flexible I/O in a compact 13 × 13 mm package footprint.

Key Features

• Core Logic  3,072 logic elements (cells) enabling implementation of custom combinational and sequential logic functions for mid-density designs.
• Embedded Memory  36,864 bits of on-chip RAM to store lookup tables, small buffers, and state information directly within the FPGA fabric.
• I/O  97 user I/O pins to support a range of peripheral interfaces and board-level connectivity.
• Gate Capacity  Approximately 125,000 gates of equivalent logic capacity for mapping legacy gate-count requirements to programmable logic.
• Power  Core supply range of 1.425 V to 1.575 V to match system power rails and enable predictable power budgeting.
• Package & Mounting  144-LBGA (Supplier package: 144-FPBGA 13×13) in a surface-mount form factor for compact PCB integration.
• Operating Range  Commercial temperature grade with specified operation from 0 °C to 85 °C.
• Compliance  RoHS-compliant device for designs requiring lead-free, environmentally conscious components.

Typical Applications

• Embedded Control  Use the FPGA to implement application-specific control logic and finite-state machines where moderate logic density and on-chip RAM are required.
• Interface Bridging  Deploy as a protocol or bus bridge using available I/O and logic elements to translate between digital interfaces on a board.
• Prototyping and Custom Logic  Ideal for developing and validating custom logic functions and glue logic in commercial product development.

Unique Advantages

• Balanced Logic and Memory:  3,072 logic elements paired with 36,864 bits of RAM provide a balanced resource set for mid-density implementations without external memory.
• Significant I/O Count:  97 user I/Os support multiple peripheral connections, reducing the need for external interface chips.
• Compact, Surface-Mount Package:  144-LBGA (13×13) delivers a small PCB footprint for space-constrained designs.
• Predictable Power Range:  Defined core voltage window (1.425 V–1.575 V) simplifies power-supply planning and integration.
• Commercial Temperature Suitability:  Rated for 0 °C to 85 °C operation for standard commercial product deployments.
• RoHS Compliance:  Supports environmentally regulated product designs and supply chain requirements.

Why Choose A3P125-2FG144?

The A3P125-2FG144 positions itself as a practical mid-density, flash-based FPGA for commercial designs that need a combination of logic elements, embedded RAM, and a substantial I/O complement in a compact LBGA package. Its defined supply voltage range and RoHS compliance make it straightforward to integrate into standard production environments.

This part is well suited to engineers and procurement teams seeking a Microchip Technology FPGA option for embedded control, interface bridging, and custom logic implementations where moderate gate count and on-chip memory are sufficient. The package and electrical specifications support streamlined PCB integration and predictable system behavior.

Request a quote or contact sales to discuss availability, pricing, and lead times for the A3P125-2FG144.