A3P125-2FGG144

The A3P125-2FGG144 is a ProASIC3 Field Programmable Gate Array (FPGA) IC designed for commercial-grade embedded logic integration. It provides 125,000 gates, 3,072 logic elements and 36,864 bits of on-chip RAM in a compact 144-LBGA surface-mount package, delivering a balance of logic capacity, I/O count and on-chip memory for commercial applications.

Key Features

• Core Logic 125,000 gates realized as 3,072 logic elements, enabling complex combinational and sequential logic implementations.
• On-chip Memory Approximately 36,864 bits of embedded RAM for logic state storage, buffering and small data tables.
• I/O Density 97 available I/Os to support multiple parallel interfaces and board-level connectivity without excessive external glue logic.
• Power and Voltage Operates from a supply range of 1.425 V to 1.575 V to match compatible system power rails.
• Package and Mounting Supplied in a 144-LBGA (144-FPBGA, 13×13) surface-mount package to suit compact board designs and automated assembly.
• Operating Range Commercial-grade temperature range from 0°C to 85°C for typical commercial environments.
• Compliance RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• Commercial embedded systems — Use the device’s 125,000 gates and 97 I/Os to implement custom control, interface and glue-logic functions in commercial products.
• Custom I/O and protocol bridging — On-chip logic and available I/Os enable protocol adaptation and board-level interface consolidation.
• Prototyping and development platforms — Compact package and moderate logic capacity make it suitable for development of commercial design concepts.

Unique Advantages

• Balanced logic and memory capacity: 3,072 logic elements and 36,864 bits of RAM provide sufficient resources for common commercial logic tasks without over-provisioning.
• High I/O count: 97 I/Os reduce the need for external buffers or expanders when implementing multiple interfaces.
• Compact surface-mount package: The 144-LBGA (144-FPBGA, 13×13) delivers a small board footprint while supporting automated assembly processes.
• Commercial temperature suitability: Rated 0°C to 85°C to align with standard commercial product environmental requirements.
• Regulatory readiness: RoHS compliance simplifies use in lead‑free manufacturing flows.

Why Choose A3P125-2FGG144?

The A3P125-2FGG144 positions itself as a practical, commercial-grade FPGA option that combines moderate logic density, on-chip RAM and a substantial I/O set within a compact 144-LBGA package. It is well suited for designers who need to implement custom logic, interface bridging or control functionality in commercial products while maintaining a small board footprint.

With clear electrical and thermal limits and RoHS compliance, this part supports cost-conscious designs that require reliable, verifiable FPGA resources and straightforward integration into surface-mount production processes.

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