A3P125-2PQ208
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 133 36864 208-BFQFP |
|---|---|
| Quantity | 467 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 133 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3P125-2PQ208 – ProASIC3 Field Programmable Gate Array (FPGA) IC 133 36864 208-BFQFP
The A3P125-2PQ208 is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology that combines on-chip logic and embedded memory in a compact surface-mount package. It provides 3,072 logic elements (approximately 125,000 gates), approximately 36.9 kbits of on-chip RAM, and 133 user I/O pins, all in a 208-BFQFP package.
Designed for commercial-grade applications, the device operates from a 1.425 V to 1.575 V core supply and is rated for 0 °C to 85 °C. The part is RoHS compliant and intended for board-level integration where moderate logic density, integrated memory, and a high I/O count are required.
Key Features
- Core Logic 3,072 logic elements supporting approximately 125,000 gates for implementing custom digital functions and state machines.
- Embedded Memory Approximately 36.9 kbits (36,864 bits) of on-chip RAM for data buffering, small lookup tables, and local storage.
- I/O Capacity 133 user I/O pins to support flexible interfacing with peripherals and external devices.
- Package & Mounting 208-BFQFP (supplier package 208-PQFP, 28 × 28) in a surface-mount form factor for compact board-level assembly.
- Power Core voltage supply range of 1.425 V to 1.575 V.
- Temperature & Grade Commercial operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- Balanced logic density: 3,072 logic elements and 125,000 gates provide a moderate-capacity FPGA option for mid-range digital designs.
- On-chip memory simplifies designs: Approximately 36.9 kbits of embedded RAM reduces dependence on external memory for small buffers and LUT storage.
- High I/O count in a compact package: 133 I/Os in a 208-BFQFP package allow dense external connectivity without large package footprints.
- Low-voltage core operation: Supported core supply range (1.425 V–1.575 V) enables integration into low-voltage power domains.
- Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial-environment deployments.
- RoHS compliant: Meets environmental lead-free requirements for compliant manufacturing.
Why Choose A3P125-2PQ208?
The A3P125-2PQ208 delivers a compact, mid-density FPGA option with integrated memory and a high I/O count in a 208-BFQFP surface-mount package. Its specification set—3,072 logic elements, approximately 36.9 kbits of on-chip RAM, 133 I/Os, and a 1.425 V–1.575 V core supply—makes it suitable for commercial embedded designs that require on-chip resources and flexible interfacing while maintaining a compact footprint.
As a Microchip Technology ProASIC3 device, this part provides a verified set of features for customers seeking predictable logic capacity, embedded memory, and RoHS compliance in a commercially rated FPGA package.
Request a quote or submit an inquiry to get pricing and availability for the A3P125-2PQ208.

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