A3P125-2PQ208

IC FPGA 133 I/O 208QFP
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 133 36864 208-BFQFP

Quantity 467 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O133Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3072Number of Logic Elements/Cells3072
Number of Gates125000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of A3P125-2PQ208 – ProASIC3 Field Programmable Gate Array (FPGA) IC 133 36864 208-BFQFP

The A3P125-2PQ208 is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology that combines on-chip logic and embedded memory in a compact surface-mount package. It provides 3,072 logic elements (approximately 125,000 gates), approximately 36.9 kbits of on-chip RAM, and 133 user I/O pins, all in a 208-BFQFP package.

Designed for commercial-grade applications, the device operates from a 1.425 V to 1.575 V core supply and is rated for 0 °C to 85 °C. The part is RoHS compliant and intended for board-level integration where moderate logic density, integrated memory, and a high I/O count are required.

Key Features

  • Core Logic  3,072 logic elements supporting approximately 125,000 gates for implementing custom digital functions and state machines.
  • Embedded Memory  Approximately 36.9 kbits (36,864 bits) of on-chip RAM for data buffering, small lookup tables, and local storage.
  • I/O Capacity  133 user I/O pins to support flexible interfacing with peripherals and external devices.
  • Package & Mounting  208-BFQFP (supplier package 208-PQFP, 28 × 28) in a surface-mount form factor for compact board-level assembly.
  • Power  Core voltage supply range of 1.425 V to 1.575 V.
  • Temperature & Grade  Commercial operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • Balanced logic density: 3,072 logic elements and 125,000 gates provide a moderate-capacity FPGA option for mid-range digital designs.
  • On-chip memory simplifies designs: Approximately 36.9 kbits of embedded RAM reduces dependence on external memory for small buffers and LUT storage.
  • High I/O count in a compact package: 133 I/Os in a 208-BFQFP package allow dense external connectivity without large package footprints.
  • Low-voltage core operation: Supported core supply range (1.425 V–1.575 V) enables integration into low-voltage power domains.
  • Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial-environment deployments.
  • RoHS compliant: Meets environmental lead-free requirements for compliant manufacturing.

Why Choose A3P125-2PQ208?

The A3P125-2PQ208 delivers a compact, mid-density FPGA option with integrated memory and a high I/O count in a 208-BFQFP surface-mount package. Its specification set—3,072 logic elements, approximately 36.9 kbits of on-chip RAM, 133 I/Os, and a 1.425 V–1.575 V core supply—makes it suitable for commercial embedded designs that require on-chip resources and flexible interfacing while maintaining a compact footprint.

As a Microchip Technology ProASIC3 device, this part provides a verified set of features for customers seeking predictable logic capacity, embedded memory, and RoHS compliance in a commercially rated FPGA package.

Request a quote or submit an inquiry to get pricing and availability for the A3P125-2PQ208.

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