A3P125-2PQG208I

The A3P125-2PQG208I is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology designed for mid-density logic integration. It provides 3,072 logic elements, 36,864 bits of on-chip RAM and 133 I/O pins in a 208-BFQFP surface-mount package, targeting industrial-grade embedded and control applications.

With a core supply window of 1.425 V to 1.575 V and an operating temperature range of -40°C to 100°C, this device is specified for systems that require defined supply and temperature tolerances and RoHS-compliant components.

Key Features

• Core Logic  3,072 logic elements provide mid-density programmable logic capacity suitable for custom control and glue-logic implementations.
• On-Chip Memory  36,864 bits of embedded RAM support small buffers, FIFOs and state storage without external memory.
• I/O Capacity  133 available I/Os accommodate multiple peripheral interfaces and custom I/O pinouts for system integration.
• Device Density  Specified as 125,000 gates, enabling consolidated logic functions within a single FPGA package.
• Package & Mounting  208-BFQFP package (supplier device package: 208-PQFP (28×28)) in a surface-mount form factor for PCB assembly.
• Power  Core supply operation between 1.425 V and 1.575 V allows integration into designs with defined low-voltage supply rails.
• Industrial Temperature Range  Rated for -40°C to 100°C operation and identified as industrial grade for use in temperature-demanding environments.
• Environmental Compliance  RoHS compliant for use in assemblies that require restricted-substance conformity.

Typical Applications

• Industrial Control  Implement machine control logic, custom sequencing and interface glue where industrial temperature tolerances and a mid-density FPGA are required.
• Signal Conditioning & I/O Aggregation  Consolidate multiple sensor or actuator interfaces using the 133 I/O pins and onboard RAM for buffering and handshake logic.
• Embedded System Glue Logic  Replace discrete logic and CPLDs with programmable logic to simplify board design and centralize customization.
• Prototyping and Low-Volume Production  Use the ProASIC3 device to validate system-level logic and I/O configurations before scaling hardware production.

Unique Advantages

• Mid-Density Integration:  3,072 logic elements and 125,000 gates allow consolidation of control and interface functions into a single FPGA, reducing component count.
• On-Chip RAM:  36,864 bits of embedded memory enable local buffering and small data storage without external memory devices, simplifying BOM and layout.
• Generous I/O:  133 I/Os provide flexibility for diverse peripheral connections and custom pin assignments on compact PCBs.
• Industrial Capability:  Rated for -40°C to 100°C operation and specified as industrial grade, suitable for equipment operating across wide temperature ranges.
• Surface-Mount 208-BFQFP:  A standardized PQFP footprint supports established PCB assembly processes and offers a compact package for dense designs.
• Regulatory Compliance:  RoHS compliance supports environmental and regulatory requirements for commercial and industrial products.

Why Choose A3P125-2PQG208I?

The A3P125-2PQG208I combines a balanced set of resources—3,072 logic elements, 36,864 bits of on-chip RAM and 133 I/Os—in a 208-BFQFP surface-mount package tailored for industrial applications. Its defined core voltage range and temperature rating make it appropriate for embedded designs that need predictable electrical and thermal characteristics.

This device suits engineers and procurement teams looking for a mid-density FPGA solution to consolidate logic, manage I/O-heavy interfaces and reduce board-level component count while maintaining RoHS compliance and industrial temperature capability.

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