A3P125-2PQ208I

The A3P125-2PQ208I is a ProASIC3 family FPGA from Microchip Technology, delivering a mid-range programmable logic resource in a 208-BFQFP package. It combines 3,072 logic elements with embedded RAM and 133 I/O pins to address industrial embedded designs that require flexible digital logic, moderate on-chip memory, and extended temperature capability.

Designed for industrial applications, this device offers a balance of integration and deployment-ready packaging, suitable for control, interface, and I/O-centric functions where a compact, surface-mount FPGA is required.

Key Features

• Logic Capacity  3,072 logic elements (cells) provide programmable resources for implementing custom digital functions and moderate complexity designs.
• Embedded Memory  Approximately 0.037 Mbits of on-chip RAM (36,864 bits) for small data buffers, state storage, and local working memory.
• I/O Count  133 user I/O pins to support multiple interfaces, sensor connections, and parallel or serial peripheral integration.
• Gate Equivalent  125,000 gates indicating overall silicon complexity suitable for mid-density logic integration.
• Power Supply  Operates from a supply range of 1.425 V to 1.575 V, enabling designs with tightly specified core-voltage requirements.
• Package & Mounting  208-BFQFP (supplier device package: 208-PQFP (28x28)) in a surface-mount form factor for PCB assembly and compact system layouts.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C, meeting the thermal demands of industrial environments.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• Industrial Control and Automation  Implements custom logic for PLC interfaces, motor control sequencing, and deterministically timed control tasks within industrial temperature ranges.
• I/O Expansion and Protocol Bridging  Acts as an interface hub to aggregate sensors and peripherals or bridge between differing logic domains using its 133 I/O pins.
• Embedded System Glue Logic  Provides customizable control and timing logic alongside microcontrollers or processors for reference designs and production systems.
• Sensor Data Aggregation  Handles local buffering and pre-processing of sensor data using on-chip RAM and programmable logic.

Unique Advantages

• Balanced Logic Density: 3,072 logic elements deliver enough resources for moderate-complexity functions without excessive board-level integration.
• Generous I/O Count: 133 I/Os enable flexible interfacing to multiple peripherals and sensors, reducing the need for external multiplexers or expanders.
• Industrial-ready Thermal Range: −40°C to 100°C qualification supports deployment in harsher environments common to industrial and automation systems.
• Compact Surface-mount Package: 208-BFQFP / 208-PQFP (28x28) offers a space-efficient mounting solution compatible with standard PCB assembly processes.
• Predictable Power Requirements: Narrow core voltage range (1.425 V to 1.575 V) simplifies power-supply planning and margin analysis.
• Standards-compliant Manufacturing: RoHS compliance aligns with common environmental and manufacturing requirements.

Why Choose A3P125-2PQ208I?

The A3P125-2PQ208I positions itself as a practical mid-density FPGA choice for engineers seeking a balance of programmable logic, on-chip memory, and substantial I/O in an industrial-grade device. Its combination of 3,072 logic elements, approximately 36,864 bits of embedded RAM, and 133 I/Os makes it well suited to control, interfacing, and embedded glue-logic roles where reliability across temperature and compact packaging matter.

Manufactured by Microchip Technology, this ProASIC3 device is appropriate for teams building production embedded systems that require predictable electrical characteristics, a surface-mount package footprint, and compliance with RoHS environmental standards.

Request a quote or submit a sales inquiry to evaluate A3P125-2PQ208I for your next industrial embedded design.