A3PN030-ZQNG68
| Part Description |
ProASIC3 nano Field Programmable Gate Array (FPGA) IC 49 68-VFQFN Exposed Pad |
|---|---|
| Quantity | 687 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 68-QFN (8x8) | Grade | Commercial | Operating Temperature | -20°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 68-VFQFN Exposed Pad | Number of I/O | 49 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 768 | ||
| Number of Gates | 30000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A3PN030-ZQNG68 – ProASIC3 nano Field Programmable Gate Array (FPGA), 49 I/O, 68-VFQFN Exposed Pad
The A3PN030-ZQNG68 is a ProASIC3 nano FPGA IC from Microchip Technology designed for compact, surface-mount digital designs. It provides a predictable logic fabric with 768 logic elements (cells) and approximately 30,000 gates for implementing glue logic, control functions, and custom I/O handling.
Packaged in a 68-VFQFN exposed pad (68-QFN, 8×8) and specified for commercial-grade operation, this device is suited to applications that require a small footprint, moderate logic capacity, and a 1.425 V to 1.575 V core supply range.
Key Features
- Core and Logic 768 logic elements (cells) and 30,000 gates provide a compact, deterministic logic fabric for combinational and sequential logic implementations.
- I/O Count 49 user I/Os to support a variety of peripheral interfacing and glue-logic tasks in constrained designs.
- Embedded Memory Total RAM bits: 0 (no on-chip RAM).
- Power Core voltage supply range: 1.425 V to 1.575 V, enabling straightforward integration with matched power rails.
- Package & Mounting 68-VFQFN exposed pad package (supplier device package: 68-QFN 8×8) in a surface-mount form factor for compact PCB layouts and thermal grounding via the exposed pad.
- Temperature & Compliance Commercial operating temperature range: −20 °C to 85 °C. RoHS-compliant construction supports environmental requirements for commercial products.
Typical Applications
- Consumer Electronics Implement interface bridging, control logic, and custom peripherals where board space and a moderate number of I/Os are priorities.
- Industrial Automation Handle glue logic, state machines, and I/O aggregation in control panels and localized controllers within the commercial temperature range.
- Communications & Networking Provide protocol adaptation, header manipulation, or signal conditioning in compact network devices requiring deterministic logic resources.
- Test & Measurement Create custom timing, control, and sequencing logic for bench equipment and production test fixtures.
Unique Advantages
- Compact, manufacturable package: 68-VFQFN exposed pad with an 8×8 QFN footprint reduces PCB area while supporting reliable surface-mount assembly.
- Deterministic logic capacity: 768 logic elements and 30,000 gates give predictable resource availability for mapping control and interface functions.
- Straightforward power requirements: Narrow core voltage range (1.425 V–1.575 V) simplifies supply design and rail selection.
- Commercial-grade suitability: Rated for −20 °C to 85 °C operation and RoHS compliance for mainstream electronic products.
- Surface-mount ready: Exposed pad package supports thermal grounding and compact assembly for production environments.
Why Choose A3PN030-ZQNG68?
The A3PN030-ZQNG68 delivers a balanced combination of compact packaging, a clearly defined logic resource set, and straightforward power and thermal characteristics for commercial embedded designs. It is well suited to engineers and teams building space-constrained boards that require reliable, deterministic logic and a moderate number of I/Os.
Backed by Microchip Technology documentation and support materials, this ProASIC3 nano device offers designers a predictable integration path and long-term availability for products in consumer, communications, industrial automation, and test applications.
Request a quote or submit an inquiry for A3PN030-ZQNG68 to receive pricing, lead-time, and availability information.

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