A3PN030-Z2VQG100

The A3PN030-Z2VQG100 is a ProASIC3 nano flash-based FPGA from Microchip Technology, delivered in a 100-pin TQFP (100-VQFP, 14×14) surface-mount package. It provides a compact, low-power programmable fabric with 768 logic elements (approximately 30,000 gates) and up to 77 user I/Os for configurable embedded logic tasks.

Designed for commercial-grade embedded applications, the device supports flash-based configuration and series-level features such as low-power operating modes and global fabric resources, enabling flexible glue logic, interface bridging, and configurable control functions within a small package and a 1.425–1.575 V core supply range.

Key Features

• Core Logic 768 logic elements (approx. 30,000 gates) provide a predictable, compact logic resource for control, glue logic, and peripheral offload.
• I/O Capacity 77 user I/Os suitable for connecting multiple peripherals, sensors, or buses in a single-package implementation.
• Flash-Based FPGA Fabric ProASIC3 nano flash architecture enables non-volatile configuration and the series’ documented low-power modes for efficient standby and runtime power management.
• Low-Power Operation Series documentation covers static (idle), sleep, shutdown and other low-power modes to reduce system power consumption when logic activity is limited.
• Global Resources & Clocking Series-level features include global resource distribution and clock aggregation/topologies to support synchronized designs across the fabric.
• Power Supply Core voltage range: 1.425 V to 1.575 V, enabling stable operation within defined supply limits.
• Package & Mounting 100-pin TQFP package (100-VQFP, 14×14) with surface-mount mounting type, suitable for compact PCB footprints.
• Commercial Temperature Grade Rated for operation from −20°C to 85°C and specified as Commercial grade.
• Environmental Compliance RoHS compliant.

Typical Applications

• Interface Bridging Use the 77 I/Os to implement protocol translators, bus adapters, or custom peripheral interfaces in commercial embedded systems.
• Control and Glue Logic Compact logic capacity (768 logic elements) for implementing control state machines, address decode, and timing-critical glue between ASICs or microcontrollers.
• Low-Power Embedded Devices Leverage the ProASIC3 nano low-power modes for battery-assisted or energy-conscious commercial applications requiring non‑volatile configuration.
• Prototyping and Evaluation Small-package, flash-configurable FPGA ideal for board-level prototypes and small-volume production where a compact, reprogrammable solution is needed.

Unique Advantages

• Non-volatile configuration: Flash-based fabric preserves programmed logic without external configuration memory, simplifying BOM and startup flow.
• Predictable logic density: 768 logic elements (≈30,000 gates) gives a clear resource budget for mapping control, glue, and interfacing functions.
• Ample I/O in a small package: 77 user I/Os in a 100-pin TQFP allow dense connectivity while keeping board area and assembly straightforward.
• Power-conscious operation: Series-level low-power modes support reduced static and dynamic power consumption for commercial embedded designs.
• Commercial temperature rating: Specified operation from −20°C to 85°C aligns with a wide range of commercial and consumer applications.
• RoHS compliant packaging: Meets common environmental compliance requirements for commercial electronics production.

Why Choose A3PN030-Z2VQG100?

The A3PN030-Z2VQG100 positions itself as a compact, flash-configurable FPGA option for commercial embedded designs that need a modest amount of programmable logic and a high I/O count in a small surface-mount package. Its ProASIC3 nano fabric provides non-volatile configuration and series-level low-power features that simplify system power management and reduce component count.

This part is a good fit for engineers seeking a reliable, reprogrammable solution for interface consolidation, custom control logic, or prototyping where package size, I/O density, and predictable logic resources matter. The device’s documented architecture and global fabric resources support synchronized designs within the constraints of its specified power and temperature ranges.

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