A3PN030-Z2QNG68I

The A3PN030-Z2QNG68I is a ProASIC3 nano field programmable gate array (FPGA) from Microchip Technology, built on a low-power flash FPGA fabric. It provides 768 logic element cells (approximately 30,000 gates) and 49 general-purpose I/O in a compact 68‑VFQFN exposed pad package for surface-mount assembly.

Designed with industrial-grade operation and documented low-power modes, this device targets compact embedded control and I/O-centric designs that require a small, flash-based FPGA with defined operating temperature and supply requirements.

Key Features

• Core Logic  768 logic element cells, approximately 30,000 gates for implementing custom combinatorial and sequential logic.
• GPIO  49 I/O pins to support sensor, control, or peripheral interfacing without additional external glue logic.
• Flash-Based Low-Power Fabric  ProASIC3 nano FPGA fabric with documented low-power modes including Static (Idle), Sleep, and Shutdown to manage power consumption in system designs.
• Memory  No embedded RAM bits reported (Total RAM Bits: 0); suitable for designs that use logic cells and external memory where required.
• Power  Operates from a defined supply range of 1.425 V to 1.575 V, enabling predictable power budgeting and supply design.
• Package & Mounting  68‑VFQFN exposed pad (supplier package listed as 68‑QFN 8×8) in a surface-mount form factor for compact PCB layouts and thermal management via exposed pad.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-stressed environments.
• Regulatory  RoHS compliant to meet common environmental and materials requirements.

Typical Applications

• Industrial control  Industrial-grade temperature range (−40 °C to 100 °C) and a compact package make this FPGA suitable for control and I/O tasks in factory and process automation equipment.
• Embedded I/O hubs  With 49 I/O pins, the device can consolidate peripheral interfaces and perform glue-logic functions in space-constrained embedded systems.
• Low-power embedded systems  Flash-based fabric and defined low-power modes (Static, Sleep, Shutdown) enable power management strategies for battery-assisted or energy-sensitive designs.

Unique Advantages

• Compact integration: The 68‑VFQFN exposed pad package offers a small PCB footprint with a thermal pad for improved heat dissipation in tight layouts.
• Predictable supply requirements: Defined operating voltage range (1.425 V to 1.575 V) simplifies power-supply design and verification.
• Industrial-ready operation: Rated for −40 °C to 100 °C operation and classified as industrial grade for deployment in demanding environments.
• Flash-based low-power architecture: ProASIC3 nano fabric includes documented low-power modes to help reduce standby and operational power where applicable.
• RoHS compliant: Materials and manufacturing meet RoHS requirements for environmental compliance.
• Right-sized logic capacity: 768 logic element cells (about 30,000 gates) provide a balance of logic density for compact control and interface functions.

Why Choose A3PN030-Z2QNG68I?

The A3PN030-Z2QNG68I positions itself as a compact, industrial-grade flash FPGA suitable for embedded applications that require a defined low-power fabric, moderate logic capacity, and a robust I/O count in a small surface-mount package. Its narrow supply-voltage window and exposed-pad QFN packaging support predictable power and thermal design.

This device is appropriate for design teams seeking a small-footprint FPGA for industrial control, I/O consolidation, or energy-conscious embedded systems. The combination of ProASIC3 nano architecture, industrial temperature rating, and RoHS compliance delivers a reliable, verifiable building block for long-lived applications.

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