A3PN030-Z2QNG48
| Part Description |
ProASIC3 nano Field Programmable Gate Array (FPGA) IC 34 48-VFQFN Exposed Pad |
|---|---|
| Quantity | 1,784 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 48-QFN (6x6) | Grade | Commercial | Operating Temperature | -20°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 48-VFQFN Exposed Pad | Number of I/O | 34 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 768 | ||
| Number of Gates | 30000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A3PN030-Z2QNG48 – ProASIC3 nano FPGA, 34 I/O, 48-VFQFN Exposed Pad
The A3PN030-Z2QNG48 is a ProASIC3 nano Field Programmable Gate Array (FPGA) IC from Microchip Technology. It implements the ProASIC3 nano FPGA fabric and is offered as a low-power, flash-based device family according to the supplied user’s guide content.
With 768 logic elements, 34 general-purpose I/O pins and a compact 48-VFQFN (6×6) exposed-pad package, this surface-mount FPGA targets designs that require small-footprint programmable logic with controlled supply and operating-temperature requirements.
Key Features
- Logic Capacity 768 logic elements (logic element cells) and approximately 30,000 gates provide a compact programmable logic resource for control, glue-logic, and custom interfaces.
- I/O 34 available I/O pins to support peripheral interfacing and board-level signal routing.
- Embedded Memory Total RAM bits: 0 (no on-chip RAM).
- Power and Voltage Specified core voltage range of 1.425 V to 1.575 V; device series documentation describes low-power flash device modes and power-management features.
- Package and Mounting 48-VFQFN exposed pad package, supplier device package 48-QFN (6×6), surface-mount mounting type—designed for compact PCB implementations and thermal conduction through the exposed pad.
- Operating Conditions Commercial grade with an operating temperature range of −20 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Embedded Control Programmable logic for small embedded control tasks where compact logic capacity and low-power operation are required.
- I/O Bridging and Glue Logic Implement custom interface translation and board-level glue logic using the device’s available I/O and logic elements.
- Portable and Space-Constrained Electronics Compact 6×6 QFN package and exposed pad allow integration in designs with limited PCB area and thermal needs.
Unique Advantages
- Flash-based, low-power FPGA fabric The ProASIC3 nano family documentation emphasizes low-power flash device modes, supporting lower static power states for energy-conscious designs.
- Compact package with thermal pad 48-VFQFN (6×6) exposed-pad footprint reduces board real estate and provides a thermal path for improved heat dissipation.
- Right-sized logic density 768 logic elements and ~30,000 gates deliver a balance of resources for control and interface tasks without excessive area or cost.
- Controlled supply requirements A narrow core voltage range (1.425 V–1.575 V) simplifies power-supply design and helps ensure deterministic operating conditions.
- Commercial temperature rating Rated for −20 °C to 85 °C operation to match a wide range of commercial embedded applications.
- RoHS compliant Meets environmental compliance expectations for mainstream electronics manufacturing.
Why Choose A3PN030-Z2QNG48?
The A3PN030-Z2QNG48 combines the ProASIC3 nano FPGA fabric with a compact 48-VFQFN exposed-pad package and clearly specified electrical and thermal parameters. It is suitable for designs that need a modest amount of programmable logic, a moderate number of I/Os, and low-power operational options within a commercial temperature range.
This part is appropriate for engineers and procurement teams seeking a small-footprint, flash-based FPGA option from Microchip Technology that simplifies board integration through a standardized QFN package and offers straightforward power and thermal characteristics for embedded projects.
Request a quote or submit an inquiry to obtain pricing, availability, and technical support information for A3PN030-Z2QNG48.

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