A3PN030-Z2QNG48

IC FPGA 34 I/O 48QFN
Part Description

ProASIC3 nano Field Programmable Gate Array (FPGA) IC 34 48-VFQFN Exposed Pad

Quantity 1,784 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package48-QFN (6x6)GradeCommercialOperating Temperature-20°C – 85°C
Package / Case48-VFQFN Exposed PadNumber of I/O34Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells768
Number of Gates30000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A3PN030-Z2QNG48 – ProASIC3 nano FPGA, 34 I/O, 48-VFQFN Exposed Pad

The A3PN030-Z2QNG48 is a ProASIC3 nano Field Programmable Gate Array (FPGA) IC from Microchip Technology. It implements the ProASIC3 nano FPGA fabric and is offered as a low-power, flash-based device family according to the supplied user’s guide content.

With 768 logic elements, 34 general-purpose I/O pins and a compact 48-VFQFN (6×6) exposed-pad package, this surface-mount FPGA targets designs that require small-footprint programmable logic with controlled supply and operating-temperature requirements.

Key Features

  • Logic Capacity  768 logic elements (logic element cells) and approximately 30,000 gates provide a compact programmable logic resource for control, glue-logic, and custom interfaces.
  • I/O  34 available I/O pins to support peripheral interfacing and board-level signal routing.
  • Embedded Memory  Total RAM bits: 0 (no on-chip RAM).
  • Power and Voltage  Specified core voltage range of 1.425 V to 1.575 V; device series documentation describes low-power flash device modes and power-management features.
  • Package and Mounting  48-VFQFN exposed pad package, supplier device package 48-QFN (6×6), surface-mount mounting type—designed for compact PCB implementations and thermal conduction through the exposed pad.
  • Operating Conditions  Commercial grade with an operating temperature range of −20 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Embedded Control  Programmable logic for small embedded control tasks where compact logic capacity and low-power operation are required.
  • I/O Bridging and Glue Logic  Implement custom interface translation and board-level glue logic using the device’s available I/O and logic elements.
  • Portable and Space-Constrained Electronics  Compact 6×6 QFN package and exposed pad allow integration in designs with limited PCB area and thermal needs.

Unique Advantages

  • Flash-based, low-power FPGA fabric  The ProASIC3 nano family documentation emphasizes low-power flash device modes, supporting lower static power states for energy-conscious designs.
  • Compact package with thermal pad  48-VFQFN (6×6) exposed-pad footprint reduces board real estate and provides a thermal path for improved heat dissipation.
  • Right-sized logic density  768 logic elements and ~30,000 gates deliver a balance of resources for control and interface tasks without excessive area or cost.
  • Controlled supply requirements  A narrow core voltage range (1.425 V–1.575 V) simplifies power-supply design and helps ensure deterministic operating conditions.
  • Commercial temperature rating  Rated for −20 °C to 85 °C operation to match a wide range of commercial embedded applications.
  • RoHS compliant  Meets environmental compliance expectations for mainstream electronics manufacturing.

Why Choose A3PN030-Z2QNG48?

The A3PN030-Z2QNG48 combines the ProASIC3 nano FPGA fabric with a compact 48-VFQFN exposed-pad package and clearly specified electrical and thermal parameters. It is suitable for designs that need a modest amount of programmable logic, a moderate number of I/Os, and low-power operational options within a commercial temperature range.

This part is appropriate for engineers and procurement teams seeking a small-footprint, flash-based FPGA option from Microchip Technology that simplifies board integration through a standardized QFN package and offers straightforward power and thermal characteristics for embedded projects.

Request a quote or submit an inquiry to obtain pricing, availability, and technical support information for A3PN030-Z2QNG48.

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