A3PN030-Z2QNG48I

The A3PN030-Z2QNG48I is a ProASIC3 nano Field Programmable Gate Array (FPGA) IC from Microchip Technology implementing the ProASIC3 nano FPGA fabric. It provides a compact, low-power programmable logic solution with 768 logic elements and approximately 30,000 gates suitable for small to mid-density embedded designs.

With 34 general-purpose I/Os, a narrow supply window and industrial temperature rating, this device is positioned for applications that require controlled power delivery, predictable logic capacity and surface-mount packaging with an exposed pad for thermal management.

Key Features

• Core / Architecture ProASIC3 nano FPGA fabric as documented in the ProASIC3 nano FPGA user materials; optimized for low-power flash-based device architecture.
• Logic Capacity 768 logic elements (reported as 768 logic element cells) and 30,000 gates provide deterministic logic resources for glue logic, control and custom peripheral functions.
• I/O 34 I/O pins suitable for sensor, control and interface connectivity in compact systems.
• On-Chip Memory No embedded RAM (Total RAM bits: 0), enabling predictable resource budgeting for designs that do not rely on on-chip block RAM.
• Power Single supply operation with a specified voltage range of 1.425 V to 1.575 V for core power.
• Package & Mounting 48-VFQFN Exposed Pad package (supplier package: 48-QFN, 6×6 mm) designed for surface-mount assembly and improved thermal dissipation via exposed pad.
• Environmental & Temperature Industrial-grade device with operating temperature from −40 °C to 100 °C and RoHS-compliant status.

Typical Applications

• Embedded Control and Glue Logic Use the A3PN030-Z2QNG48I to implement custom control logic, protocol adapters and board-level glue where 768 logic elements and 34 I/Os meet system requirements.
• Sensor and I/O Aggregation Integrate multiple sensor inputs and simple pre-processing or conditioning functions using available I/O and programmable logic resources.
• Industrial Equipment Control Suitable for compact industrial modules operating across −40 °C to 100 °C that need deterministic programmable logic in a surface-mount QFN package.

Unique Advantages

• Right-sized Logic Density: 768 logic elements and ~30,000 gates provide a clear resource envelope for small-to-mid complexity designs without over-provisioning.
• Deterministic Resource Model: Zero on-chip RAM simplifies resource planning for designs that use external memory or do not require embedded block RAM.
• Compact Thermal-Friendly Package: 48-VFQFN with exposed pad and 6×6 mm QFN footprint supports space-constrained boards while enabling thermal dissipation through the pad.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation, supporting longer-term deployment in industrial environments.
• Narrow, Defined Core Supply: A specified core voltage window (1.425 V to 1.575 V) enables precise power design and predictable device behavior.
• RoHS-Compliant: Conforms to RoHS requirements for environmental compliance where applicable.

Why Choose A3PN030-Z2QNG48I?

The A3PN030-Z2QNG48I positions itself as a practical ProASIC3 nano FPGA option when designers need an efficient, flash-based low-power fabric with defined logic and I/O capacity. Its combination of 768 logic elements, 34 I/Os, industrial temperature rating and a thermal-friendly 48-VFQFN exposed pad package make it appropriate for compact embedded controllers, I/O aggregation modules and other applications where predictable resources and surface-mount assembly are priorities.

Engineers and procurement teams will find this Microchip Technology device useful for projects that require clear resource budgeting, stable operating temperature performance and compliance with RoHS rules—delivering a straightforward FPGA option for tightly scoped, industrial-grade embedded designs.

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