A3PN030-Z2QNG68

The A3PN030-Z2QNG68 is a ProASIC3 nano FPGA from Microchip Technology, built on the ProASIC3 nano fabric and targeted at commercial embedded designs. It delivers a compact, flash-based programmable logic solution with 768 logic elements and a logic capacity of 30,000 gates, optimized for low-power operation and I/O-centric applications.

This device is well suited to commercial embedded systems and portable products that require flexible interfacing, low static power modes and a small form-factor package. Key value comes from its combination of logic density, multiple low-power modes documented in the ProASIC3 nano user guide, and a 68‑VFQFN exposed pad package for PCB integration.

Key Features

• Core — ProASIC3 nano fabric  Flash-based FPGA fabric designed for configurable logic implementations; documented low-power architecture and fabric user guidance are provided in the ProASIC3 nano user’s guide.
• Logic Capacity  768 logic elements (LEs) providing a total of approximately 30,000 gates for glue logic, control functions and custom processing.
• I/O  49 general-purpose I/Os to support diverse peripheral, sensor and interface connections.
• On-chip Memory  Total RAM bits: 0 (no embedded RAM reported for this device).
• Low-Power Support  Multiple low-power modes are documented for the ProASIC3 nano family, including Static (Idle), User Low Static (Idle), Sleep and Shutdown modes to reduce power consumption in standby or inactive states.
• Supply Voltage  Core supply range: 1.425 V to 1.575 V, enabling deterministic power budgeting for system design.
• Package & Mounting  68‑pin VFQFN with exposed pad (supplier device package: 68‑QFN, 8×8); surface-mount mounting supports compact PCB layouts and thermal management via the exposed pad.
• Operating Range & Grade  Commercial grade device with an operating temperature range of −20 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Implement control logic, protocol adaptation and custom peripheral interfaces in space-constrained commercial products.
• Portable and Battery-Powered Devices  Use documented low-power modes to reduce standby and idle energy consumption in handheld and portable equipment.
• I/O Expansion & Interface Bridging  Leverage 49 I/Os to consolidate glue logic, translate between interfaces and aggregate signals in compact designs.
• Consumer Electronics  Integrate custom logic and control sequencing for consumer-grade products requiring a small package and commercial temperature operation.

Unique Advantages

• Compact, manufacturable package: 68‑VFQFN with exposed pad and surface-mount format enables dense PCB layouts and improved thermal path for the core.
• Predictable power domain: Narrow core supply range (1.425–1.575 V) simplifies power-supply design and voltage-margin planning.
• Flash-based, documented low-power fabric: The ProASIC3 nano user’s guide details multiple power modes (Static, Sleep, Shutdown), helping optimize system-level power management.
• Right-sized logic for glue and control: 768 logic elements and 30,000 gates provide a balance of capacity for control, interfacing and modest custom logic without large-device overhead.
• Commercial temperature suitability: Rated for −20 °C to 85 °C operation to match a wide range of commercial product environments.
• Regulatory-friendly manufacturing: RoHS compliance supports lead‑free assembly processes.

Why Choose A3PN030-Z2QNG68?

The A3PN030-Z2QNG68 delivers a focused combination of logic density, flash-based configurable fabric and I/O count in a compact 68‑VFQFN package aimed at commercial embedded applications. Its documented low-power modes and narrow core voltage range make it straightforward to integrate into power-conscious product designs while keeping PCB footprint minimal.

This part is suited for engineers building commercial-grade products that need reliable, reprogrammable logic for interface consolidation, control tasks and modest custom processing. The device’s characteristics support scalable designs and simpler BOMs where on-chip embedded RAM is not required.

Request a quote or submit an inquiry to receive pricing and availability for the A3PN030-Z2QNG68 and to discuss how it fits your next embedded design.