A3PN060-2VQ100I
| Part Description |
ProASIC3 nano Field Programmable Gate Array (FPGA) IC 71 18432 100-TQFP |
|---|---|
| Quantity | 1,508 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 71 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 1536 | ||
| Number of Gates | 60000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of A3PN060-2VQ100I – ProASIC3 nano Field Programmable Gate Array (FPGA) IC 71 18432 100-TQFP
The A3PN060-2VQ100I is a ProASIC3 nano FPGA from Microchip Technology, offering a compact reprogrammable logic device with integrated on-chip memory and a 100-pin TQFP package. It delivers a balance of logic capacity, I/O density and embedded RAM for implementing custom digital functions in industrial environments.
With 1,536 logic elements, 18,432 bits of on-chip RAM and 71 I/O, this device is suited to designs that require moderate logic integration, deterministic configuration, and operation across an extended industrial temperature range.
Key Features
- Core Logic 1,536 logic elements (cells) providing approximately 60,000 equivalent gates for implementing custom digital logic.
- Embedded Memory 18,432 total RAM bits of on-chip memory to support small buffers, state machines, and lookup tables.
- I/O Density 71 user I/O pins to support multi-signal interfacing and peripheral connectivity in compact designs.
- Power Supply Core voltage supply range of 1.425 V to 1.575 V for the device core.
- Package and Mounting Available in a 100-pin TQFP package (supplier device package: 100-VQFP, 14×14); surface mount mounting type for PCB assembly.
- Industrial Temperature Rated for operation from −40 °C to 100 °C to support deployments in extended temperature environments.
- Environmental Compliance RoHS compliant to meet standard environmental and manufacturing requirements.
Typical Applications
- Custom Digital Logic — Implement state machines, control logic, and protocol glue logic where moderate gate count and reprogrammability are needed.
- I/O Expansion and Interfacing — Use the 71 I/O pins to consolidate peripheral interfaces, signal conditioning, and simple protocol bridging.
- Embedded Memory Functions — Leverage the on-chip RAM for small data buffers, lookup tables and temporary storage in control or signal-processing pipelines.
- Industrial Electronics — Designed to operate across −40 °C to 100 °C, suitable for industrial control, monitoring and instrumentation applications.
Unique Advantages
- Compact Logic Capacity: 1,536 logic elements provide a practical balance between functionality and board footprint for mid-range FPGA needs.
- Integrated On‑Chip RAM: 18,432 bits of embedded memory reduce the need for external SRAM for small buffering and LUT storage.
- Ample I/O: 71 I/O pins enable flexible interfacing to sensors, peripherals and buses without adding external I/O expanders.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
- Standard Surface-Mount Package: 100-pin TQFP (14×14) fits common PCB assembly flows while keeping the device footprint predictable.
- Regulatory Compliance: RoHS compliant to meet common manufacturing and environmental requirements.
Why Choose A3PN060-2VQ100I?
The A3PN060-2VQ100I delivers a concise, reprogrammable logic solution that combines 1,536 logic elements, modest on-chip RAM and 71 I/O in a 100-pin TQFP package. Its industrial temperature rating and RoHS compliance make it appropriate for designs that require reliable operation across a wide temperature range and adherence to environmental standards.
This device is well suited for engineers and procurement teams targeting mid-density FPGA capabilities in compact footprints—offering a straightforward option for integrating custom logic, I/O interfacing and small memory requirements with predictable power and packaging specifications.
Request a quote or submit an inquiry for pricing and availability to evaluate the A3PN060-2VQ100I for your next design.

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