A3PN060-2VQ100I

IC FPGA 71 I/O 100VQFP
Part Description

ProASIC3 nano Field Programmable Gate Array (FPGA) IC 71 18432 100-TQFP

Quantity 1,508 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-TQFPNumber of I/O71Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells1536
Number of Gates60000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of A3PN060-2VQ100I – ProASIC3 nano Field Programmable Gate Array (FPGA) IC 71 18432 100-TQFP

The A3PN060-2VQ100I is a ProASIC3 nano FPGA from Microchip Technology, offering a compact reprogrammable logic device with integrated on-chip memory and a 100-pin TQFP package. It delivers a balance of logic capacity, I/O density and embedded RAM for implementing custom digital functions in industrial environments.

With 1,536 logic elements, 18,432 bits of on-chip RAM and 71 I/O, this device is suited to designs that require moderate logic integration, deterministic configuration, and operation across an extended industrial temperature range.

Key Features

  • Core Logic 1,536 logic elements (cells) providing approximately 60,000 equivalent gates for implementing custom digital logic.
  • Embedded Memory 18,432 total RAM bits of on-chip memory to support small buffers, state machines, and lookup tables.
  • I/O Density 71 user I/O pins to support multi-signal interfacing and peripheral connectivity in compact designs.
  • Power Supply Core voltage supply range of 1.425 V to 1.575 V for the device core.
  • Package and Mounting Available in a 100-pin TQFP package (supplier device package: 100-VQFP, 14×14); surface mount mounting type for PCB assembly.
  • Industrial Temperature Rated for operation from −40 °C to 100 °C to support deployments in extended temperature environments.
  • Environmental Compliance RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

  • Custom Digital Logic — Implement state machines, control logic, and protocol glue logic where moderate gate count and reprogrammability are needed.
  • I/O Expansion and Interfacing — Use the 71 I/O pins to consolidate peripheral interfaces, signal conditioning, and simple protocol bridging.
  • Embedded Memory Functions — Leverage the on-chip RAM for small data buffers, lookup tables and temporary storage in control or signal-processing pipelines.
  • Industrial Electronics — Designed to operate across −40 °C to 100 °C, suitable for industrial control, monitoring and instrumentation applications.

Unique Advantages

  • Compact Logic Capacity: 1,536 logic elements provide a practical balance between functionality and board footprint for mid-range FPGA needs.
  • Integrated On‑Chip RAM: 18,432 bits of embedded memory reduce the need for external SRAM for small buffering and LUT storage.
  • Ample I/O: 71 I/O pins enable flexible interfacing to sensors, peripherals and buses without adding external I/O expanders.
  • Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
  • Standard Surface-Mount Package: 100-pin TQFP (14×14) fits common PCB assembly flows while keeping the device footprint predictable.
  • Regulatory Compliance: RoHS compliant to meet common manufacturing and environmental requirements.

Why Choose A3PN060-2VQ100I?

The A3PN060-2VQ100I delivers a concise, reprogrammable logic solution that combines 1,536 logic elements, modest on-chip RAM and 71 I/O in a 100-pin TQFP package. Its industrial temperature rating and RoHS compliance make it appropriate for designs that require reliable operation across a wide temperature range and adherence to environmental standards.

This device is well suited for engineers and procurement teams targeting mid-density FPGA capabilities in compact footprints—offering a straightforward option for integrating custom logic, I/O interfacing and small memory requirements with predictable power and packaging specifications.

Request a quote or submit an inquiry for pricing and availability to evaluate the A3PN060-2VQ100I for your next design.

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