A3PN060-2VQG100

IC FPGA 71 I/O 100VQFP
Part Description

ProASIC3 nano Field Programmable Gate Array (FPGA) IC 71 18432 100-TQFP

Quantity 1,526 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeCommercialOperating Temperature-20°C – 85°C
Package / Case100-TQFPNumber of I/O71Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells1536
Number of Gates60000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of A3PN060-2VQG100 – ProASIC3 nano Field Programmable Gate Array (FPGA) IC, 100-TQFP

The A3PN060-2VQG100 is a ProASIC3 nano Field Programmable Gate Array (FPGA) from Microchip Technology. It provides moderate-density programmable logic with 1,536 logic elements, approximately 18 kbits of on-chip RAM, and 71 user I/O in a compact 100-TQFP surface-mount package.

Designed for commercial-grade electronic designs, this device combines low-voltage operation and a small-footprint package to support integration of custom digital functions in space-constrained applications.

Key Features

  • Logic Capacity  1,536 logic elements (LEs) supporting up to 60,000 gates for implementing moderate-density digital functions.
  • Embedded Memory  Approximately 18,432 bits (~18 kbits) of on-chip RAM for small buffering, state storage, and lookup tables.
  • I/O and Integration  71 user I/O pins provide flexible system interfacing in a single-package FPGA solution.
  • Power  Core supply voltage range of 1.425 V to 1.575 V to match low-voltage system domains.
  • Package and Mounting  100-TQFP (supplier device package: 100-VQFP, 14 × 14 mm) in a surface-mount form factor for compact PCB layouts.
  • Operating Conditions  Commercial-grade operation from −20 °C to 85 °C for general-purpose electronic applications.
  • Compliance  RoHS compliant for environmentally conscious designs.

Typical Applications

  • Embedded Logic Integration  Implement glue logic, protocol adaptation, and custom control functions where moderate logic density and on-chip memory are required.
  • I/O Expansion and Interface Bridging  Use the 71 user I/O pins to expand system connectivity or bridge between different digital interfaces in compact designs.
  • Small FIFO and Buffering  Leverage approximately 18 kbits of embedded RAM for small FIFOs, buffering, and lookup-table storage in data-path applications.

Unique Advantages

  • Compact, manufacturable package: 100-TQFP surface-mount package (100-VQFP, 14 × 14 mm) enables dense PCB layouts and automated assembly.
  • Balanced logic and memory: 1,536 logic elements combined with ~18 kbits of RAM supports a wide range of moderate-density designs without external memory.
  • Low-voltage core: 1.425 V to 1.575 V supply range facilitates integration with low-voltage system domains.
  • Commercial temperature rating: −20 °C to 85 °C supports a broad set of commercial electronic applications.
  • Regulatory friendliness: RoHS compliance simplifies environmental and supply-chain requirements.

Why Choose A3PN060-2VQG100?

The A3PN060-2VQG100 positions itself as a practical, compact FPGA for designers needing moderate-density programmable logic and on-chip memory in a surface-mount 100-TQFP package. Its combination of 1,536 logic elements, approximately 18 kbits of embedded RAM, and 71 I/O pins makes it well suited to space-constrained commercial electronic designs that require flexible digital integration.

Backed by Microchip Technology, the device offers a straightforward specification set—including a low-voltage core and RoHS compliance—that helps streamline BOM decisions and long-term procurement for commercial projects.

Request a quote or submit an inquiry today to learn about availability and pricing for the A3PN060-2VQG100.

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