A3PN060-Z2VQG100I

The A3PN060-Z2VQG100I is a ProASIC3 nano field programmable gate array (FPGA) IC in a 100‑TQFP package. It provides a compact, industrial‑grade programmable logic solution with 1536 logic elements, 71 general‑purpose I/Os and 18,432 bits of embedded RAM, making it suitable for embedded control and interface applications requiring on‑chip logic and memory.

Designed with a dedicated low‑voltage core (1.425 V to 1.575 V) and a wide operating temperature range (−40 °C to 100 °C), the device targets designs that require reliable, reprogrammable logic in constrained board space and industrial environments.

Key Features

• Core Logic — 1536 logic elements (logic cells) providing reprogrammable combinational and sequential logic capacity, supporting glue logic and small to medium control functions.
• On‑Chip Memory — 18,432 bits of embedded RAM for buffering, small FIFOs or lookup tables within the FPGA fabric.
• I/O Count — 71 general‑purpose I/Os to support sensor interfaces, communication lines, and peripheral control without external I/O expanders.
• Logic Density — Specified as 60,000 gates, enabling integration of multiple control and glue functions into a single device.
• Power and Voltage — Core supply range 1.425 V to 1.575 V, suitable for low‑voltage system cores and for matching modern embedded power rails.
• Package and Mounting — Surface‑mount 100‑TQFP (100‑VQFP, 14 × 14 mm supplier package) for compact PCB footprint and standard SMT assembly.
• Industrial Temperature Grade — Rated for −40 °C to 100 °C operation for use in industrial and harsh‑environment applications.
• Regulatory — RoHS compliant.
• Fabric Documentation — Supported by ProASIC3 nano FPGA fabric user documentation covering device architecture and low‑power modes.

Typical Applications

• Industrial Control — Use the industrial temperature rating and 71 I/Os for machine control, sensor aggregation, and realtime interface logic in factory environments.
• Embedded Interface Logic — Implement protocol bridging, signal conditioning and glue logic between microcontrollers and peripherals using on‑chip RAM and 1536 logic elements.
• Low‑Power Systems — Leverage documented low‑power modes in the ProASIC3 nano fabric alongside the device’s low‑voltage core for energy‑sensitive embedded applications.
• Prototype and Custom Logic — Compact 100‑TQFP package with accessible I/Os for rapid development of custom digital functions and system integration tasks.

Unique Advantages

• Compact, manufacturable package: The 100‑TQFP surface‑mount package (14 × 14 mm supplier VQFP) reduces board area while supporting standard SMT assembly processes.
• Industrial reliability: Rated for −40 °C to 100 °C operation, enabling deployment in harsh or temperature‑varying environments.
• Integrated memory and logic: 18,432 bits of embedded RAM combined with 1536 logic elements simplifies designs by keeping buffering and small data storage on chip.
• Generous I/O availability: 71 general‑purpose I/Os allow direct connection to a broad range of sensors, actuators and peripheral devices, reducing external components.
• Low‑voltage core compatibility: The 1.425 V–1.575 V supply range supports integration with modern low‑voltage power domains.
• RoHS compliant: Meets environmental requirements for lead‑free assembly and regulatory compliance in commercial electronics.

Why Choose A3PN060-Z2VQG100I?

The A3PN060-Z2VQG100I positions itself as a compact, industrial‑grade programmable logic device for engineers who need reprogrammable logic, on‑chip memory and a healthy I/O count in a small footprint. Its combination of 1536 logic elements, 18,432 bits of embedded RAM and 71 I/Os makes it suitable for consolidating glue logic, implementing interface protocols, and embedding control functions without significant board real estate.

Backed by ProASIC3 nano documentation covering device architecture and low‑power modes, the device supports design reuse and power‑aware implementations. It is an option for teams seeking a reliable, RoHS‑compliant FPGA solution for industrial and embedded applications where temperature range, low‑voltage operation and compact packaging matter.

Request a quote or submit a product inquiry to get pricing and availability for A3PN060-Z2VQG100I. Representatives can provide lead‑time information and support for volume requirements and technical questions.