A3PN125-ZVQ100I

The A3PN125-ZVQ100I is a ProASIC3 nano field programmable gate array (FPGA) IC from Microchip Technology. It provides a compact, industrial‑grade programmable logic solution with 3,072 logic elements, 125,000 gates and 36,864 bits of on‑chip RAM, making it suitable for embedded control and interface tasks.

Designed for industrial applications, the device combines flexible I/O (71 I/Os), a narrow supply window (1.425 V to 1.575 V) and wide operating temperature range (−40 °C to 100 °C), with package options optimized for surface‑mount assembly (100‑TQFP / 100‑VQFP 14×14). The platform also includes low‑power operating modes and global resource architectures documented in the ProASIC3 nano family user guide.

Key Features

• Core Logic — 3,072 logic elements (3072 logic elements) and approximately 125,000 gates provide programmable combinational and sequential resources for custom digital functions.
• Embedded Memory — 36,864 bits of on‑chip RAM support buffering, small FIFOs and local data storage for control and interface logic.
• I/O Capacity — 71 general‑purpose I/Os enable multiple peripheral connections, bus interfaces and glue logic integration on a single device.
• Power and Low‑Power Modes — Supported family documentation describes Static (Idle), User Low Static (Idle), Sleep and Shutdown modes to manage power in deployed systems.
• Supply and Thermal — Tight core supply range (1.425 V to 1.575 V) and extended industrial temperature rating (−40 °C to 100 °C) for reliable operation in challenging environments.
• Package and Mounting — 100‑pin TQFP surface‑mount package (supplier package: 100‑VQFP, 14×14 mm) for compact PCB layouts and automated assembly.
• Global Resources & Clocking — Family documentation highlights global resource networks (VersaNet), spine architecture and clock aggregation features to support device‑level routing and timing strategies.
• Compliance — RoHS compliant for regulatory alignment in standard industrial supply chains.

Typical Applications

• Industrial Control — Logic consolidation and custom control functions in equipment that require industrial temperature operation and surface‑mount packaging.
• Interface and Glue Logic — Protocol bridging, bus interfacing and signal conditioning where 71 I/Os and on‑chip RAM reduce external components.
• Embedded System Integration — Local processing, state machines and I/O management in embedded modules leveraging the device’s logic and memory resources.
• Low‑Power Designs — Power‑sensitive systems that can utilize the documented low‑power modes to reduce idle and standby energy consumption.

Unique Advantages

• Industrial‑rated operation: −40 °C to 100 °C operating range supports deployment in temperature‑challenging environments.
• Balanced logic and memory: 3,072 logic elements paired with 36,864 bits of RAM enables compact implementations of control, buffering and sequencing functions without large external SRAM.
• Compact, manufacturable package: 100‑TQFP (100‑VQFP, 14×14) surface‑mount package simplifies PCB integration and standard automated assembly processes.
• Power management options: Documented low‑power modes (Static, User Low Static, Sleep, Shutdown) allow designers to optimize energy use across operating states.
• System‑level routing and clock support: Global resource and clocking architectures described for the ProASIC3 nano family help implement predictable distribution of signals and clocks across the array.
• Regulatory alignment: RoHS compliance supports environmentally regulated product builds and supply chains.

Why Choose A3PN125-ZVQ100I?

The A3PN125-ZVQ100I positions itself as a reliable, industrial‑grade programmable logic device for embedded designs requiring a balance of logic density, on‑chip memory and versatile I/O. Its compact 100‑pin TQFP package, defined supply window and extended temperature range make it suitable for systems where board space, controlled power rails and environmental robustness are important.

For engineering teams building industrial controllers, interface modules or low‑power embedded systems, this ProASIC3 nano device offers a documented family architecture (including low‑power modes and global resource networks) that supports scalable designs and predictable behavior across deployment conditions.

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