A3PN125-ZVQ100
| Part Description |
ProASIC3 nano Field Programmable Gate Array (FPGA) IC 71 36864 100-TQFP |
|---|---|
| Quantity | 747 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Commercial | Operating Temperature | -20°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 71 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3PN125-ZVQ100 – ProASIC3 nano Field Programmable Gate Array (FPGA) IC 71 36864 100-TQFP
The A3PN125-ZVQ100 is a ProASIC3 nano flash-based FPGA from Microchip Technology, providing user-configurable programmable logic in a low-power flash architecture. It combines 3,072 logic elements with embedded memory and a broad set of I/Os to support compact, power-conscious designs that require on-board reprogrammability.
Designed for commercial-grade applications, the device delivers a measured set of resources—including on-chip RAM, I/O count, and a 100-pin TQFP package—making it suitable for embedded control, interface bridging, and system integration tasks where board space and power are constrained.
Key Features
- Programmable Logic Core Approximately 3,072 logic elements (logic element cells) and 125,000 equivalent gates enable implementation of combinational and sequential logic functions on-chip.
- On-Chip Memory Total embedded memory of 36,864 bits (approximately 0.037 Mbits) for small FIFOs, buffering, and state storage directly within the FPGA fabric.
- I/O Capability 71 user I/O pins support a variety of external interfaces and board-level signaling requirements.
- Low-Power Flash Architecture Flash-based ProASIC3 nano fabric with documented low-power operating modes (Static/Idle, User Low Static, Sleep, Shutdown) to help minimize system power when full activity is not required.
- Supply Voltage Nominal core supply range of 1.425 V to 1.575 V for direct integration into tightly specified power domains.
- Package & Mounting Surface-mount 100-lead TQFP package; supplier references a 100-VQFP (14 × 14 mm) package variant for assembly considerations.
- Operating Range Commercial-grade operating temperature from −20 °C to 85 °C for typical embedded and consumer deployments.
- Compliance RoHS-compliant material and manufacturing status.
Typical Applications
- Embedded Control and Glue Logic Use the 3,072 logic elements and 71 I/Os to implement board-level control, protocol bridging, and custom interface logic with local memory buffering.
- Low-Power Sensor & IoT Nodes Flash-based fabric and multiple low-power modes support designs that require minimized standby and idle power consumption.
- Peripheral and Interface Management Leverage on-chip RAM and dedicated I/Os for small data buffering, handshaking, and timing adaptation between subsystems.
Unique Advantages
- Flash-Based Nonvolatile Configuration: Allows retained configuration after power cycles without external configuration memory, simplifying system design.
- Compact Logic and Memory Balance: The combination of 3,072 logic elements and 36,864 bits of embedded RAM supports efficient implementation of control logic with local storage, reducing external components.
- Multiple Low-Power Modes: Documented static, sleep, and shutdown modes enable designers to optimize power use across active and idle states.
- Commercial Temperature Support: Specified operation from −20 °C to 85 °C for mainstream consumer and industrial-adjacent applications that require commercial-grade classification.
- Surface-Mount 100-TQFP Package: A standardized 100-lead TQFP footprint provides a compact, assembly-friendly option for space-constrained PCBs.
- RoHS Compliance: Meets RoHS requirements for material composition and environmental compliance.
Why Choose A3PN125-ZVQ100?
The A3PN125-ZVQ100 places a practical set of programmable resources—3,072 logic elements, approximately 36.9k bits of embedded RAM, and 71 I/Os—into a compact 100-TQFP surface-mount package, paired with a flash-based low-power architecture. This combination suits teams that need on-board reprogrammability, modest logic density, and low standby power without adding external configuration memory.
Ideal for designers building embedded controllers, interface bridges, and low-power subsystems, the device offers clear integration benefits for cost- and space-sensitive designs while providing predictable supply-voltage and temperature envelopes for reliable system integration.
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