A42MX09-PQ100A
| Part Description |
MX Field Programmable Gate Array (FPGA) IC 83 100-BQFP |
|---|---|
| Quantity | 113 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 100-PQFP (20x14) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-BQFP | Number of I/O | 83 | Voltage | 3 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 684 | Number of Logic Elements/Cells | 336 | ||
| Number of Gates | 14000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 |
Overview of A42MX09-PQ100A – MX Field Programmable Gate Array (FPGA) IC 83 100-BQFP
The A42MX09-PQ100A is an MX family Field Programmable Gate Array (FPGA) optimized for embedded logic integration in temperature‑sensitive applications. It provides reconfigurable logic resources and flexible I/O in a compact 100‑pin BQFP package.
Designed and qualified for automotive use (AEC‑Q100), the device supports a wide operating temperature and supply voltage range, making it suitable for automotive electronics and other harsh‑environment embedded systems that require configurable digital logic and robust qualification.
Key Features
- Core Logic 336 logic element cells and 14,000 gates provide reconfigurable digital logic capacity for glue logic, custom controllers, and protocol handling.
- Configurable Logic Blocks (CLBs) 684 CLBs available to structure logic functions and implement parallel or pipelined architectures.
- I/O Count 83 general-purpose I/O pins to support multiple interfaces, sensor connections, and peripheral control lines.
- Memory No on‑chip RAM (0 total RAM bits), enabling predictable resource planning when external memory is required.
- Supply Voltage Operates from 3 V to 5.25 V, suitable for common automotive and embedded power rails.
- Temperature Range & Qualification Rated for operation from −40°C to 125°C and AEC‑Q100 qualified for automotive system integration.
- Package & Mounting 100‑pin BQFP (supplier package: 100‑PQFP, 20×14 mm) in a surface‑mount form factor for compact PCB layouts.
- Grade Automotive grade device with AEC‑Q100 qualification for designs requiring automotive reliability standards.
Typical Applications
- Automotive control modules — Reconfigurable logic for engine, chassis, or body electronics where AEC‑Q100 qualification and wide temperature range are required.
- Custom I/O and interface bridging — 83 I/O pins support diverse sensor and actuator connections, enabling protocol translation and signal conditioning logic.
- Embedded logic integration — Implement glue logic, state machines, and custom control functions using the device’s CLBs and logic elements.
- Harsh‑environment embedded systems — Rated operation from −40°C to 125°C supports applications exposed to wide temperature swings.
Unique Advantages
- AEC‑Q100 qualification: Built and qualified for automotive reliability, providing confidence for safety‑conscious and high‑reliability deployments.
- Wide operating range: 3 V to 5.25 V supply and −40°C to 125°C operation accommodate common automotive and embedded power/thermal conditions.
- Balanced logic capacity: 336 logic element cells and 14,000 gates offer a mid‑range FPGA resource set for cost‑effective custom logic implementations.
- Ample I/O: 83 I/O pins simplify integration with sensors, actuators, and external peripherals without adding additional interface components.
- Compact surface‑mount package: 100‑pin BQFP (100‑PQFP, 20×14 mm) supports space‑constrained PCB designs while keeping mounting simple.
Why Choose A42MX09-PQ100A?
The A42MX09-PQ100A offers a combination of automotive qualification, a robust operating range, and a practical set of logic and I/O resources for designers who need reliable, reconfigurable digital logic in demanding environments. Its CLB and logic element complement is well suited to mid‑complexity control, interface, and customization tasks where on‑chip RAM is not required.
This part is aimed at engineers developing automotive or harsh‑environment embedded systems that require predictable, qualified silicon with a compact footprint and flexible I/O. Its qualification and thermal/supply tolerances make it a straightforward choice for designs that prioritize reliability and reconfigurability.
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