A42MX24-TQG176

IC FPGA 150 I/O 176TQFP
Part Description

MX Field Programmable Gate Array (FPGA) IC 150 176-LQFP

Quantity 532 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package176-TQFP (24x24)GradeCommercialOperating Temperature0°C – 70°C
Package / Case176-LQFPNumber of I/O150Voltage3 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1890Number of Logic Elements/Cells912
Number of Gates36000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A42MX24-TQG176 – MX Field Programmable Gate Array (FPGA) IC 150 I/O 176-LQFP

The A42MX24-TQG176 is a commercial-grade MX family Field Programmable Gate Array (FPGA) offered in a 176-pin LQFP surface-mount package. It provides 912 logic elements and approximately 36,000 gates with up to 150 general-purpose I/O, enabling compact programmable logic implementations for a range of commercial embedded designs.

Designed for systems operating from 3 V to 5.25 V and across a 0°C to 70°C operating range, this device balances moderate logic capacity and I/O density with standard package and supply compatibility for mainstream electronic products.

Key Features

  • Core Logic: 912 logic elements and 36,000 gates provide the programmable fabric required for glue logic, protocol handling and moderate-complexity control functions.
  • I/O Density: 150 general-purpose I/O pins support extensive peripheral interfacing and board-level connectivity in a single-package FPGA.
  • Memory: Total on-chip RAM: 0 bits; suitable where external memory or minimal embedded RAM usage is acceptable.
  • Power Supply Range: Operates from 3 V to 5.25 V to match common system voltage rails and enable flexible power architectures.
  • Package and Mounting: 176-LQFP surface-mount package; supplier device package listed as 176-TQFP (24×24), supporting compact PCB designs.
  • Operating Conditions: Commercial-grade operation from 0°C to 70°C for standard commercial electronics applications.
  • Regulatory: RoHS compliant to meet environmental and lead-free requirements.

Typical Applications

  • Embedded control and glue logic: Use the FPGA’s 912 logic elements and 150 I/O to implement board-level control, protocol conversion, and interface aggregation without multiple discrete devices.
  • Peripheral interfacing: High I/O count supports parallel sensor arrays, bus bridging, and custom I/O expansion in commercial equipment.
  • Prototyping and evaluation: Compact LQFP package and standard supply range make the device suitable for development platforms and proof-of-concept designs targeting commercial products.

Unique Advantages

  • Balanced logic and I/O capacity: 912 logic elements paired with 150 I/O pins deliver a practical combination of resources for moderate-complexity designs without unnecessary overhead.
  • Standard voltage compatibility: 3 V to 5.25 V supply range simplifies integration with common legacy and modern system rails.
  • Compact surface-mount package: 176-LQFP / 176-TQFP (24×24) allows dense PCB layouts while keeping I/O accessible for routing and routing flexibility.
  • Commercial operating range: Rated for 0°C to 70°C, matching typical commercial-product environmental requirements.
  • RoHS compliant: Meets lead-free and hazardous-substance restrictions for global commercial product deployment.

Why Choose A42MX24-TQG176?

The A42MX24-TQG176 positions itself as a straightforward, commercially rated FPGA for designers needing moderate logic capacity with substantial I/O in a compact surface-mount package. Its combination of 912 logic elements, 150 I/O pins, and a standard 3 V–5.25 V supply range makes it suitable for embedded control, interface consolidation, and prototyping within commercial product lines.

Choosing this device offers predictable integration: a defined logic resource set, clear thermal and voltage limits, and RoHS compliance—helping teams streamline BOM decisions and PCB design while relying on a familiar package and operating envelope.

Request a quote or submit a procurement inquiry to receive pricing and availability specific to your project requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up