A42MX24-TQG176
| Part Description |
MX Field Programmable Gate Array (FPGA) IC 150 176-LQFP |
|---|---|
| Quantity | 532 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 176-TQFP (24x24) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 176-LQFP | Number of I/O | 150 | Voltage | 3 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1890 | Number of Logic Elements/Cells | 912 | ||
| Number of Gates | 36000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A42MX24-TQG176 – MX Field Programmable Gate Array (FPGA) IC 150 I/O 176-LQFP
The A42MX24-TQG176 is a commercial-grade MX family Field Programmable Gate Array (FPGA) offered in a 176-pin LQFP surface-mount package. It provides 912 logic elements and approximately 36,000 gates with up to 150 general-purpose I/O, enabling compact programmable logic implementations for a range of commercial embedded designs.
Designed for systems operating from 3 V to 5.25 V and across a 0°C to 70°C operating range, this device balances moderate logic capacity and I/O density with standard package and supply compatibility for mainstream electronic products.
Key Features
- Core Logic: 912 logic elements and 36,000 gates provide the programmable fabric required for glue logic, protocol handling and moderate-complexity control functions.
- I/O Density: 150 general-purpose I/O pins support extensive peripheral interfacing and board-level connectivity in a single-package FPGA.
- Memory: Total on-chip RAM: 0 bits; suitable where external memory or minimal embedded RAM usage is acceptable.
- Power Supply Range: Operates from 3 V to 5.25 V to match common system voltage rails and enable flexible power architectures.
- Package and Mounting: 176-LQFP surface-mount package; supplier device package listed as 176-TQFP (24×24), supporting compact PCB designs.
- Operating Conditions: Commercial-grade operation from 0°C to 70°C for standard commercial electronics applications.
- Regulatory: RoHS compliant to meet environmental and lead-free requirements.
Typical Applications
- Embedded control and glue logic: Use the FPGA’s 912 logic elements and 150 I/O to implement board-level control, protocol conversion, and interface aggregation without multiple discrete devices.
- Peripheral interfacing: High I/O count supports parallel sensor arrays, bus bridging, and custom I/O expansion in commercial equipment.
- Prototyping and evaluation: Compact LQFP package and standard supply range make the device suitable for development platforms and proof-of-concept designs targeting commercial products.
Unique Advantages
- Balanced logic and I/O capacity: 912 logic elements paired with 150 I/O pins deliver a practical combination of resources for moderate-complexity designs without unnecessary overhead.
- Standard voltage compatibility: 3 V to 5.25 V supply range simplifies integration with common legacy and modern system rails.
- Compact surface-mount package: 176-LQFP / 176-TQFP (24×24) allows dense PCB layouts while keeping I/O accessible for routing and routing flexibility.
- Commercial operating range: Rated for 0°C to 70°C, matching typical commercial-product environmental requirements.
- RoHS compliant: Meets lead-free and hazardous-substance restrictions for global commercial product deployment.
Why Choose A42MX24-TQG176?
The A42MX24-TQG176 positions itself as a straightforward, commercially rated FPGA for designers needing moderate logic capacity with substantial I/O in a compact surface-mount package. Its combination of 912 logic elements, 150 I/O pins, and a standard 3 V–5.25 V supply range makes it suitable for embedded control, interface consolidation, and prototyping within commercial product lines.
Choosing this device offers predictable integration: a defined logic resource set, clear thermal and voltage limits, and RoHS compliance—helping teams streamline BOM decisions and PCB design while relying on a familiar package and operating envelope.
Request a quote or submit a procurement inquiry to receive pricing and availability specific to your project requirements.

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