A54SX32A-PQ208M

IC FPGA 174 I/O 208QFP
Part Description

SX-A Field Programmable Gate Array (FPGA) IC 174 208-BFQFP

Quantity 1,502 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case208-BFQFPNumber of I/O174Voltage2.25 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2880Number of Logic Elements/Cells2880
Number of Gates48000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/A

Overview of A54SX32A-PQ208M – SX-A Field Programmable Gate Array (FPGA) IC 174 208-BFQFP

The A54SX32A-PQ208M is a military-grade FPGA from the SX-A family, delivering a nonvolatile, single‑chip programmable solution in a 208‑pin PQFP package. It combines a high logic capacity with a broad operating voltage range and extended temperature capability for designs that require robust, deterministic programmable logic.

Designed for applications demanding high I/O density and reliable operation in harsh environments, this device provides a balance of performance, configurability, and system-level features drawn from the SX‑A series architecture.

Key Features

  • Core & capacity — Approximately 48,000 system gates and 2,880 logic elements, enabling mid‑range logic integration for complex glue‑logic, protocol handling, and control functions.
  • I/O & interface flexibility — 174 user‑programmable I/Os in the 208‑pin package with configurable support for mixed‑voltage signaling and 5 V input tolerance.
  • Performance — Series performance guidance includes up to 250 MHz system performance and up to 350 MHz internal performance for timing‑sensitive designs.
  • Power and sequencing — Power‑up/down friendly operation (no sequencing required) and hot‑swap compliant I/Os to simplify board power management and field replaceability.
  • Security & diagnostics — Series features include secure programming technology to protect bitstream IP and in‑system diagnostic/verification capability for design verification.
  • Voltage & power rails — Wide supply range of 2.25 V to 5.25 V, supporting mixed‑voltage operation across device I/Os.
  • Package & mounting — 208‑pin BFQFP (Plastic Quad Flat Pack) package, surface‑mount mounting type for standard PCB assembly processes.
  • Rugged temperature grade — Military temperature grade rated for operation from −55 °C to 125 °C.
  • On‑chip memory — No embedded RAM bits (Total RAM Bits = 0), optimizing the device for control, glue logic, and state machine implementations rather than large data buffering.
  • Standards & testing — Series includes boundary‑scan (IEEE 1149.1 JTAG) support for board test and in‑system programming.

Typical Applications

  • Military & aerospace systems — Utilizes the military temperature grade (−55 °C to 125 °C) and rugged packaging for avionics, tactical, and ruggedized electronic modules where extended temperature operation and reliability are required.
  • Communications and networking — High I/O count and deterministic timing support interface bridging, protocol processing, and card‑level logic on PCI or mixed‑voltage backplanes.
  • Embedded control and instrumentation — Well suited for control logic, sensor interfacing, and deterministic state machines in measurement and instrumentation equipment.
  • Field‑replaceable and hot‑swap systems — Hot‑swap compliant I/Os and power‑up/down friendly behavior simplify maintenance and module replacement in live systems.

Unique Advantages

  • Highly integrated logic capacity: 48,000 system gates and 2,880 logic elements reduce external glue logic and simplify board design.
  • Military‑grade thermal performance: Qualified for −55 °C to 125 °C operation to meet rugged deployment requirements.
  • Flexible mixed‑voltage I/O: Wide supply range and configurable I/O support different signaling standards on a single device, reducing level‑shifter needs.
  • Nonvolatile single‑chip solution: Eliminates the need for external configuration memory and shortens system boot procedures.
  • Security and in‑system verification: Built‑in secure programming and diagnostic features help protect IP and ease in‑field testing and validation.
  • Board‑level reliability and serviceability: Hot‑swap compliant I/Os and power‑sequencing tolerance aid modular system maintenance and reduce downtime.

Why Choose A54SX32A-PQ208M?

The A54SX32A-PQ208M delivers a practical blend of logic capacity, I/O density, and military‑grade environmental tolerance for applications that require reliable in‑system programmability without external configuration memory. Its mixed‑voltage I/O support, hot‑swap capability, and deterministic performance characteristics make it a solid choice for communications, embedded control, and rugged systems.

For engineers and procurement teams building long‑life, serviceable hardware, this SX‑A family device provides a compact, single‑chip solution that simplifies board design while addressing stringent thermal and security needs.

If you would like pricing, availability, or a quotation for the A54SX32A-PQ208M, request a quote or submit an inquiry and include your required quantities and delivery timeframe.

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