AFS1500-1FG256I

The AFS1500-1FG256I is a Fusion® Field Programmable Gate Array (FPGA) IC designed for industrial-grade, reconfigurable logic applications. It provides a balanced mix of logic density, embedded memory, and I/O in a compact 256-LBGA package.

With 38,400 logic elements, approximately 0.276 Mbits of embedded memory, 119 I/O pins and a supply range of 1.425 V to 1.575 V, this device targets industrial designs that require moderate on-chip resources, predictable power rails, and a wide operating temperature range.

Key Features

• Core Architecture & Density Fusion FPGA architecture offering 38,400 logic elements and approximately 1,500,000 gates for implementing complex programmable logic functions.
• Embedded Memory Total on-chip RAM of 276,480 bits (approximately 0.276 Mbits) to support local data buffering and state storage.
• I/O and Connectivity 119 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Package and Mounting 256-LBGA package (supplier package: 256-FPBGA, 17×17) with surface-mount mounting suitable for compact board layouts.
• Power Narrow recommended voltage supply range of 1.425 V to 1.575 V to support stable core operation.
• Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C for robust performance in demanding environments.
• Regulatory RoHS compliant to meet environmental material requirements.

Typical Applications

• Industrial Control Systems — Reconfigurable logic and 119 I/O make this FPGA suitable for control, sequencing, and interface consolidation in industrial equipment.
• Embedded Instrumentation — On-chip memory and logic density support custom signal handling, preprocessing, and real-time data paths in instrumentation hardware.
• Prototyping and Custom Logic — Compact 256-LBGA packaging and surface-mount mounting support space-constrained prototype and production boards requiring industrial temperature capability.

Unique Advantages

• High logic capacity in a compact package: 38,400 logic elements and ~1.5M gates in a 256-LBGA allow substantial logic integration without large form factors.
• On-chip memory for local buffering: Approximately 0.276 Mbits of embedded RAM reduces dependence on external memory for moderate data storage needs.
• Industrial operating range: Rated from −40 °C to 100 °C for deployment in harsher environments where extended temperature tolerance is required.
• Predictable power domain: A defined supply window of 1.425 V to 1.575 V supports consistent core behavior and simplified power planning.
• RoHS compliant: Meets common environmental material standards for commercial and industrial products.

Why Choose AFS1500-1FG256I?

The AFS1500-1FG256I positions itself as a practical Fusion® FPGA option for industrial applications that need a balance of logic density, on-chip RAM, and I/O capacity within a compact 256-LBGA footprint. Its industrial temperature rating and RoHS compliance make it suitable for long-term use in equipment where environmental resilience matters.

This device is well suited for engineers and procurement teams developing industrial control, embedded instrumentation, and compact systems that require reconfigurable logic with defined power and temperature characteristics.

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