AGL1000V5-FG256I

IC FPGA 177 I/O 256FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 177 147456 24576 256-LBGA

Quantity 345 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case256-LBGANumber of I/O177Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of AGL1000V5-FG256I – IGLOO Field Programmable Gate Array (FPGA) 256-LBGA

The AGL1000V5-FG256I is an IGLOO Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a dense programmable logic fabric with 24,576 logic elements and approximately 1,000,000 gates, combined with embedded RAM and a high I/O count for compact, application-specific digital designs.

Targeted for industrial applications, the device delivers a balance of integration and I/O capability in a compact 256-ball BGA package, with an industrial operating temperature range and RoHS compliance for deployment in commercial and industrial environments.

Key Features

  • Logic Capacity 24,576 logic elements (listed as 24,576 LABs/CLBs in source data), delivering roughly 1,000,000 gates of programmable logic for glue logic, state machines, and custom datapaths.
  • Embedded Memory 147,456 total RAM bits of on-chip memory (≈0.15 Mbits) for buffering, FIFOs, and small data-store functions within the FPGA design.
  • I/O Resources 177 user I/O pins to support multi-channel interfaces, sensor and actuator connectivity, or protocol bridging directly on-chip.
  • Power Supply Core supply voltage range of 1.425 V to 1.575 V to match system power rails and regulator designs.
  • Package & Mounting 256-ball LBGA package; supplier device package referenced as 256-FPBGA (17×17). Surface-mount mounting type supports compact board-level integration.
  • Industrial Temperature Grade Rated for operation from −40 °C to 85 °C, suitable for industrial temperature environments.
  • Environmental Compliance RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

  • Industrial Control Systems — Industrial-grade operating range (−40 °C to 85 °C) and 177 I/Os make the device suitable for control logic, I/O aggregation, and real-time interfacing in factory and process equipment.
  • Embedded Glue Logic — Large logic element count and 1,000,000 gates enable integration of custom control, protocol conversion, and peripheral management within compact systems.
  • Sensor and Actuator Interfacing — High I/O density supports multi-sensor aggregation, signal conditioning interfaces, and actuator control in embedded measurement and automation designs.
  • Compact, High-Pin-Count Designs — 256-ball LBGA/256-FPBGA (17×17) package provides a small board footprint while maintaining significant pin count for complex integrations.

Unique Advantages

  • High Logic Density: 24,576 logic elements and approximately 1,000,000 gates enable substantial on-chip customization without external ASICs or large FPGA families.
  • On-Chip Memory: 147,456 bits of embedded RAM provide local buffering and small data storage for state machines, FIFOs, and intermediate data paths.
  • Generous I/O Count: 177 I/O pins allow direct connection to multiple peripherals, sensors, and external logic, reducing the need for additional interface components.
  • Industrial Readiness: Specified for −40 °C to 85 °C operation and labeled as industrial grade, supporting deployment in demanding environments.
  • Compact BGA Package: 256-ball LBGA (supplier: 256-FPBGA 17×17) enables high-density PCB layouts while keeping a small board footprint.
  • Regulatory Compatibility: RoHS compliance aligns the device with modern manufacturing and environmental requirements.

Why Choose AGL1000V5-FG256I?

The AGL1000V5-FG256I delivers a balanced combination of logic capacity, on-chip memory, and I/O resources in a compact 256-ball BGA footprint. Its industrial temperature rating and RoHS compliance make it a practical choice for embedded and industrial designs that require significant programmable logic and connectivity while maintaining a small board area.

Manufactured by Microchip Technology under the IGLOO product name, this FPGA is well suited to engineers and procurement teams looking for a dense, industrial-grade programmable device for custom control, interface consolidation, and mid-complexity digital designs.

Request a quote or submit an inquiry to receive pricing and availability for the AGL1000V5-FG256I. Our team can provide lead-time information and assist with part selection for your application.

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