AGL1000V5-FG256I
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 177 147456 24576 256-LBGA |
|---|---|
| Quantity | 345 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 177 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of AGL1000V5-FG256I – IGLOO Field Programmable Gate Array (FPGA) 256-LBGA
The AGL1000V5-FG256I is an IGLOO Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a dense programmable logic fabric with 24,576 logic elements and approximately 1,000,000 gates, combined with embedded RAM and a high I/O count for compact, application-specific digital designs.
Targeted for industrial applications, the device delivers a balance of integration and I/O capability in a compact 256-ball BGA package, with an industrial operating temperature range and RoHS compliance for deployment in commercial and industrial environments.
Key Features
- Logic Capacity 24,576 logic elements (listed as 24,576 LABs/CLBs in source data), delivering roughly 1,000,000 gates of programmable logic for glue logic, state machines, and custom datapaths.
- Embedded Memory 147,456 total RAM bits of on-chip memory (≈0.15 Mbits) for buffering, FIFOs, and small data-store functions within the FPGA design.
- I/O Resources 177 user I/O pins to support multi-channel interfaces, sensor and actuator connectivity, or protocol bridging directly on-chip.
- Power Supply Core supply voltage range of 1.425 V to 1.575 V to match system power rails and regulator designs.
- Package & Mounting 256-ball LBGA package; supplier device package referenced as 256-FPBGA (17×17). Surface-mount mounting type supports compact board-level integration.
- Industrial Temperature Grade Rated for operation from −40 °C to 85 °C, suitable for industrial temperature environments.
- Environmental Compliance RoHS compliant for lead-free manufacturing and regulatory alignment.
Typical Applications
- Industrial Control Systems — Industrial-grade operating range (−40 °C to 85 °C) and 177 I/Os make the device suitable for control logic, I/O aggregation, and real-time interfacing in factory and process equipment.
- Embedded Glue Logic — Large logic element count and 1,000,000 gates enable integration of custom control, protocol conversion, and peripheral management within compact systems.
- Sensor and Actuator Interfacing — High I/O density supports multi-sensor aggregation, signal conditioning interfaces, and actuator control in embedded measurement and automation designs.
- Compact, High-Pin-Count Designs — 256-ball LBGA/256-FPBGA (17×17) package provides a small board footprint while maintaining significant pin count for complex integrations.
Unique Advantages
- High Logic Density: 24,576 logic elements and approximately 1,000,000 gates enable substantial on-chip customization without external ASICs or large FPGA families.
- On-Chip Memory: 147,456 bits of embedded RAM provide local buffering and small data storage for state machines, FIFOs, and intermediate data paths.
- Generous I/O Count: 177 I/O pins allow direct connection to multiple peripherals, sensors, and external logic, reducing the need for additional interface components.
- Industrial Readiness: Specified for −40 °C to 85 °C operation and labeled as industrial grade, supporting deployment in demanding environments.
- Compact BGA Package: 256-ball LBGA (supplier: 256-FPBGA 17×17) enables high-density PCB layouts while keeping a small board footprint.
- Regulatory Compatibility: RoHS compliance aligns the device with modern manufacturing and environmental requirements.
Why Choose AGL1000V5-FG256I?
The AGL1000V5-FG256I delivers a balanced combination of logic capacity, on-chip memory, and I/O resources in a compact 256-ball BGA footprint. Its industrial temperature rating and RoHS compliance make it a practical choice for embedded and industrial designs that require significant programmable logic and connectivity while maintaining a small board area.
Manufactured by Microchip Technology under the IGLOO product name, this FPGA is well suited to engineers and procurement teams looking for a dense, industrial-grade programmable device for custom control, interface consolidation, and mid-complexity digital designs.
Request a quote or submit an inquiry to receive pricing and availability for the AGL1000V5-FG256I. Our team can provide lead-time information and assist with part selection for your application.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D