AGL1000V5-FG484I

IC FPGA 300 I/O 484FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 300 147456 24576 484-BGA

Quantity 998 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BGANumber of I/O300Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of AGL1000V5-FG484I – IGLOO Field Programmable Gate Array (FPGA) IC, 300 I/Os, 147,456 RAM bits, 24,576 logic elements, 484-BGA

The AGL1000V5-FG484I is an IGLOO flash-based FPGA engineered for low-power, single-chip system designs. Based on the IGLOO family architecture, it combines reprogrammable nonvolatile flash configuration with a dense programmable fabric to address control, interface and embedded logic tasks in industrial applications.

This device delivers a balance of capacity and efficiency with 24,576 logic elements, approximately 0.147 Mbits of embedded RAM, up to 300 user I/Os and support for low-voltage core operation. Its combination of Flash*Freeze ultra-low-power modes and instant-on flash technology makes it suited for systems requiring persistent configuration and tight power budgets.

Key Features

  • Programmable Logic Capacity — 24,576 logic elements (cells) providing up to 1,000,000 system gates for implementing complex control and interface logic.
  • Embedded Memory — Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) for buffering, state storage and embedded data structures.
  • I/O — Up to 300 user I/Os with mixed-voltage bank support as described in product series documentation, enabling flexible interfacing to a range of peripherals and I/O standards.
  • Low-Power Operation — Flash*Freeze technology and low-power active modes (series-featured) enabling ultra-low quiescent power (down to single-digit microwatts) while retaining FPGA content and critical registers.
  • Nonvolatile Flash Configuration — Flash-based configuration retains programmed design when power is removed and provides instant-on behavior for fast start-up.
  • Clocking and Performance — Integrated clock conditioning and PLL capabilities in the IGLOO family to support system clocking needs (refer to series datasheet for PLL and CCC options).
  • Industrial Package and Mounting — 484-ball FPBGA (23 × 23) surface-mount package, ideal for compact board layouts in industrial designs.
  • Voltage and Temperature — Core supply range 1.425 V to 1.575 V and operating temperature range −40 °C to 85 °C suitable for industrial environments.
  • Compliance — RoHS compliant for environmental regulation adherence.

Typical Applications

  • Industrial Control and Automation — Implement control logic, I/O aggregation and system sequencing where industrial temperature range and reliable nonvolatile configuration are required.
  • Embedded Interfaces and Protocol Bridging — Use the device’s programmable fabric and abundant I/Os to implement protocol conversion, bus bridging, and custom interface logic.
  • Power-Sensitive Systems — Leverage Flash*Freeze and low-power active modes for applications that need persistent configuration with very low standby power.
  • Prototyping and Low-Volume ASIC Replacement — Reprogrammability and instant-on behavior make the device suitable for converting ASIC functions to a single-chip, reprogrammable solution during development or low-volume production.

Unique Advantages

  • Highly Integrated Logic and Memory: Combines 24,576 logic elements and approximately 0.147 Mbits of on-chip RAM to reduce external component count and simplify board design.
  • Persistent, Reprogrammable Configuration: Flash-based configuration retains designs when powered off and supports rapid system start-up without external configuration memory.
  • Ultra-Low Power Modes: Flash*Freeze and low-power active capabilities allow retention of SRAM and registers while consuming microwatts, enabling energy-efficient system standby strategies.
  • Flexible I/O and Package: Up to 300 I/Os in a compact 484-FPBGA (23×23) surface-mount package supports dense, mixed-voltage interfacing in space-constrained designs.
  • Industrial Operational Range: Specified operation from −40 °C to 85 °C and RoHS compliance align the device with industrial deployment requirements.

Why Choose AGL1000V5-FG484I?

The AGL1000V5-FG484I positions itself as a lower-power, flash-configured FPGA option for designers needing a robust combination of logic density, embedded memory and extensive I/O in an industrial-grade package. Its flash configuration and low-power modes support designs that must preserve configuration across power cycles and minimize standby energy consumption.

This device is well suited to engineers and product teams building industrial control, interface bridging, and low-power embedded systems who require reprogrammability, compact packaging and reliable operation over a broad temperature range. The IGLOO family’s flash technology and integrated clocking features provide a practical, single-chip alternative for scalable, long-term designs.

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