AGL1000V5-FGG256I

The AGL1000V5-FGG256I is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial embedded designs. It integrates 24,576 logic elements, approximately 0.147 Mbits of embedded memory, and roughly 1,000,000 gates in a 256-pin LBGA package for compact, high-density implementations.

With 177 user I/Os, a surface-mount 256-FPBGA (17×17) package, and an operating range of -40 °C to 85 °C, this FPGA is suited to industrial applications that require robust, reconfigurable logic with defined supply and thermal characteristics.

Key Features

• Core Logic  24,576 logic elements provide substantial on-chip programmable logic capacity to implement complex digital functions.
• Embedded Memory  Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for data buffering, state storage, and small lookup tables.
• I/O Capacity  177 user I/Os support diverse interfacing requirements and flexible pinout configurations in the 256-LBGA package.
• Density and Gate Count  Approximately 1,000,000 gates delivers the logical scale needed for integrated system functions within a single device.
• Power Supply  Single-core supply requirement of 1.425 V to 1.575 V, enabling straightforward power rail planning for the programmable core.
• Package and Mounting  256-LBGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for high-density PCB layouts.
• Industrial Temperature Grade  Rated for operation from -40 °C to 85 °C, aligning with industrial environmental requirements.
• Compliance  RoHS compliant, meeting common environmental and material restrictions for electronic assemblies.

Typical Applications

• Industrial Control  Industrial systems that require programmable logic and operation across -40 °C to 85 °C can leverage the device’s logic density and industrial grade.
• Embedded Processing  Compact embedded designs needing substantial logic and on-chip RAM benefit from the 24,576 logic elements and 147,456 bits of memory.
• High-Density I/O Interfaces  Designs that require multiple external connections can use the 177 I/Os available in the 256-LBGA package.

Unique Advantages

• High logic capacity: 24,576 logic elements enable implementation of complex functions and consolidation of multiple discrete components into one FPGA.
• Compact, high-pin package: The 256-LBGA (256-FPBGA, 17×17) package provides a small footprint while offering 177 usable I/Os for dense board designs.
• Industrial temperature rating: Operation from -40 °C to 85 °C supports deployment in demanding environmental conditions.
• Defined core power requirement: A narrow supply window (1.425 V to 1.575 V) simplifies power budgeting and core voltage regulation.
• RoHS compliant: Meets material restriction requirements for modern electronic manufacturing processes.
• Substantial gate count: Approximately 1,000,000 gates provide headroom for integrating multiple digital subsystems on a single device.

Why Choose AGL1000V5-FGG256I?

The AGL1000V5-FGG256I positions itself as a robust, industrial-grade FPGA option for engineers seeking significant programmable logic, solid on-chip memory, and a high I/O count in a compact LBGA package. Its defined supply range and operating temperature make it a predictable choice for industrial and embedded applications where environmental and power parameters are important design constraints.

Designed and supplied by Microchip Technology and compliant with RoHS requirements, this FPGA is suitable for teams focused on scalable, integrated designs that require reliable vendor-backed components and clear electrical and thermal specifications.

Request a quote or submit a procurement inquiry today to evaluate AGL1000V5-FGG256I for your next industrial or embedded FPGA design project.