AGL125V2-CS196
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 133 36864 3072 196-TFBGA, CSBGA |
|---|---|
| Quantity | 995 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 196-CSP (8x8) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 196-TFBGA, CSBGA | Number of I/O | 133 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of AGL125V2-CS196 – IGLOO Flash FPGA, 133 I/Os, 3072 logic elements, 196‑TFBGA
The AGL125V2-CS196 is an IGLOO family flash FPGA IC from Microchip Technology, offering a low-power, reprogrammable single-chip FPGA solution in a compact 196‑TFBGA (CSBGA) package. Built on flash-based FPGA architecture, it targets applications that require nonvolatile configuration, small footprint, and energy-efficient operation.
With 3,072 logic elements and 36,864 bits of embedded RAM, this device delivers a balance of logic capacity and on-chip memory suitable for embedded control, system power management, and compact digital designs operating within a commercial temperature range.
Key Features
- IGLOO Flash FPGA Architecture Flash-based, reprogrammable FPGA family technology that retains programmed design when powered off.
- Logic Capacity 3,072 logic elements (cells) providing approximately 125,000 system gates for implementation of moderate-complexity logic.
- Embedded Memory 36,864 total RAM bits of on-chip SRAM for data buffering and state storage.
- I/O & Interfaces 133 user I/Os to support mixed-signal interfacing across multiple banks and external peripherals.
- Low-Power Operation Series-level Flash*Freeze and Low Power Active capabilities enable ultra-low power modes (series datasheet cites as little as 5 μW in Flash*Freeze and ~12 μW in Low Power Active) while retaining SRAM and register content.
- Clocking and Timing Integrated clock conditioning and PLL functionality are available in the IGLOO family for system clock management (series-level feature).
- Power Supply Core voltage support per device: 1.14 V to 1.575 V to accommodate low-voltage system designs.
- Package & Mounting Surface-mount 196‑TFBGA (CSBGA) package; supplier package referenced as 196‑CSP (8×8) for compact board integration.
- Operating Range & Compliance Commercial grade device with an operating temperature range of 0 °C to 70 °C and RoHS compliance.
Typical Applications
- Low‑power embedded systems Use the AGL125V2-CS196 where retaining configuration and minimizing standby power are important for battery‑sensitive designs.
- System power management Implement control logic that monitors inputs and manages system power states while taking advantage of ultra‑low power idle modes.
- Compact digital controllers Small footprint package and mixed‑voltage I/O support make this device suitable for space‑constrained control and interface applications.
- Secure, reprogrammable designs Flash-based nonvolatile configuration enables in-system reprogramming and retention of design after power‑down.
Unique Advantages
- Low standby and active power Series-level Flash*Freeze and Low Power Active features enable very low power consumption while maintaining device state.
- Nonvolatile, reprogrammable configuration Flash-based storage preserves the programmed design when power is removed, simplifying system bring-up and field updates.
- Balanced logic and memory 3,072 logic elements combined with 36,864 bits of on-chip RAM deliver practical resources for control, interfacing, and buffering without external memory.
- Compact package 196‑TFBGA package supports dense board designs where PCB space is constrained.
- Commercial readiness Designed for commercial temperature operation (0 °C to 70 °C) and RoHS compliant for standard product deployments.
Why Choose AGL125V2-CS196?
The AGL125V2-CS196 provides a practical combination of low-power operation, nonvolatile flash configuration, and compact packaging for embedded designs that require reprogrammability and retention of configuration across power cycles. With 3,072 logic elements, 36,864 bits of embedded RAM, and 133 user I/Os, it is well suited for system control, interface logic, and power-management roles in space-constrained applications.
Backed by Microchip Technology’s IGLOO family architecture and flash FPGA features, this device is a fit for teams seeking a single-chip, low-power FPGA solution that simplifies BOM and supports in-system updates while operating within commercial environment requirements.
Request a quote or submit a pricing inquiry for the AGL125V2-CS196 to begin evaluating this IGLOO flash FPGA for your next design.

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