AGL1000V5-FGG484I

The AGL1000V5-FGG484I is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial-temperature applications. It provides a programmable logic fabric with 24,576 logic elements, approximately 1,000,000 gates and embedded RAM to support control, interfacing and custom-logic functions in compact surface-mount designs.

With up to 300 I/O pins, a 484-ball FBGA package, and a controlled core supply range of 1.425–1.575 V, this device targets designs that require moderate to high logic density and robust thermal tolerance for industrial environments.

Key Features

• Logic Capacity — 24,576 logic elements providing approximately 1,000,000 gates for implementing complex combinational and sequential logic.
• Embedded Memory — 147,456 bits of on-chip RAM (approximately 0.147 Mbits) to support buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Count — Up to 300 I/O pins to accommodate multi-interface and parallel connections in I/O-dense applications.
• Power Supply — Core voltage range of 1.425 V to 1.575 V to match system power rails and ensure predictable device operation.
• Package & Mounting — 484-ball BGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for high-density PCB integration.
• Temperature Grade — Industrial operating range from −40 °C to 85 °C suitable for industrial-class environments.
• Compliance — RoHS compliant to meet lead-free assembly and environmental requirements.

Typical Applications

• Industrial Control Systems — Implement custom control logic and interface bridging in systems that require industrial temperature tolerance (−40 °C to 85 °C).
• I/O-Intensive Interface Hubs — Support multiple parallel or serial interfaces using up to 300 available I/Os for bridging and protocol conversion tasks.
• Embedded Logic and Glue — Replace discrete glue logic with a programmable solution offering 24,576 logic elements and on-chip RAM for state machines and buffering.
• Compact, High-Density Boards — 484-BGA (23×23) package enables integration on space-constrained PCBs while retaining significant logic and memory resources.

Unique Advantages

• High Logic Density: 24,576 logic elements and approximately 1,000,000 gates allow consolidation of multiple functions into a single FPGA, reducing part count.
• On-Chip Memory: 147,456 bits of embedded RAM provide local storage for buffering and lookup tables, simplifying external memory requirements.
• Generous I/O Resources: Up to 300 I/Os support complex system-level interfacing without additional expansion devices.
• Industrial Temperature Support: Rated for −40 °C to 85 °C, enabling deployment in industrial environments where extended temperature tolerance is required.
• Compact BGA Package: 484-FPBGA (23×23) delivers a high pin count in a small footprint suitable for dense board layouts.
• Standards Compliance: RoHS compliance supports lead-free manufacturing and regulatory alignment.

Why Choose AGL1000V5-FGG484I?

The AGL1000V5-FGG484I provides a balanced combination of logic capacity, embedded memory and I/O density in a compact surface-mount BGA package suited to industrial-temperature designs. Its specification set—24,576 logic elements, approximately 147,456 bits of on-chip RAM, and up to 300 I/Os—makes it well suited for developers consolidating control, interface and custom-logic functions onto a single FPGA.

Backed by Microchip Technology, this device is appropriate for teams and projects that require predictable supply voltage operation, RoHS compliance, and a package optimized for high-density PCB integration. It delivers a practical platform for scaling embedded logic designs while keeping board area and component count under control.

Request a quote or submit a purchasing inquiry to receive pricing and availability for AGL1000V5-FGG484I tailored to your project requirements.