AGL125V2-CSG196I

The AGL125V2-CSG196I is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a compact, surface-mount FPGA implementation with on-chip logic, embedded RAM, and a broad I/O count for industrial embedded designs.

With 3,072 logic elements, 36,864 bits of internal RAM, and 133 I/Os, this device is positioned for applications that require moderate logic capacity, low-voltage operation, and operation across an industrial temperature range.

Key Features

• Core Logic 3,072 logic elements (cells) delivering programmable combinational and sequential logic capacity; approximately 125,000 equivalent gates for design implementation.
• Embedded Memory 36,864 bits of on-chip RAM (approximately 36.9 kbits) for data buffering, small LUT-based storage and state retention.
• I/O Density 133 general-purpose I/Os to support multi-channel interfaces, control signals and peripheral connectivity within compact designs.
• Power Low-voltage operation with a supply range of 1.14 V to 1.575 V to support energy-conscious system architectures and compatibility with low-voltage domains.
• Package & Mounting 196-TFBGA (CSBGA) package with supplier device package listed as 196-CSP (8×8); surface-mount mounting type for automated PCB assembly.
• Temperature & Grade Industrial grade device rated for operation from −40 °C to 85 °C, suitable for deployments requiring extended temperature range tolerance.
• Compliance RoHS compliant to support regulatory and sustainability requirements.

Typical Applications

• Industrial Control Implement control logic, state machines and interfacing tasks using 3,072 logic elements and 133 I/Os within industrial temperature environments.
• Protocol Bridging and Glue Logic Use the device’s I/O density and programmable logic to translate or bridge signals between subsystems in compact, low-voltage designs.
• Sensor and I/O Aggregation Aggregate and preprocess signals from multiple sensors or peripherals leveraging on-chip RAM for buffering and the available I/O count for connectivity.

Unique Advantages

• Compact BGA Footprint: The 196-TFBGA/196-CSP (8×8) package enables high-density placement and a small PCB area for space-constrained designs.
• Balanced Logic and Memory: 3,072 logic elements combined with 36,864 bits of embedded RAM provide a practical balance for mid-range logic and data-buffering needs.
• Low-Voltage Operation: Operates from 1.14 V to 1.575 V, allowing integration into low-voltage power rails and reducing system power budgets.
• Industrial Temperature Rating: Rated for −40 °C to 85 °C to meet thermal requirements of industrial and harsh-environment applications.
• High I/O Count: 133 I/Os give design flexibility for interfacing multiple peripherals, sensors, and subsystems without external multiplexing.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious manufacturing and supply chains.

Why Choose AGL125V2-CSG196I?

The AGL125V2-CSG196I combines a mid-range logic fabric with embedded memory and a high I/O count in a compact BGA package, making it suitable for industrial and embedded applications that require programmable logic within a constrained board footprint. Its low-voltage supply range and industrial temperature rating support deployment in systems with stringent power and environmental requirements.

Manufactured by Microchip Technology, this IGLOO FPGA variant is a practical option for engineers and procurement teams seeking a surface-mount, RoHS-compliant programmable device with clear, verifiable specifications for logic, memory, I/O and operating conditions.

Request a quote or submit a procurement inquiry for part number AGL125V2-CSG196I to begin sourcing and to obtain pricing and availability information for your project requirements.