AGL125V2-FGG144
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 97 36864 3072 144-LBGA |
|---|---|
| Quantity | 942 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of AGL125V2-FGG144 – IGLOO Field Programmable Gate Array (FPGA) IC 97 36864 3072 144-LBGA
The AGL125V2-FGG144 is a flash-based IGLOO low-power FPGA optimized for commercial embedded applications. Built on Microchip’s IGLOO family architecture, it combines reprogrammable flash configuration, low-power modes, and a compact 144-LBGA package to deliver a single-chip, instant-on FPGA solution.
This device targets designs that require moderate logic density, on-chip SRAM, and flexible I/O while prioritizing low power consumption and retained configuration during standby.
Key Features
- Logic Capacity — 3,072 logic elements (3072 logic elements) with an equivalent of 125,000 gates for implementing control, glue-logic, and mid-density processing functions.
- Embedded Memory — Approximately 36.9 kbits (36,864 bits) of true embedded RAM for buffers, FIFOs, and small state machines.
- I/O and Package — 97 user I/Os in a 144-LBGA package (supplier package: 144-FPBGA, 13×13); surface-mount mounting for compact board designs.
- Low-Voltage Operation — Core supply range specified at 1.14 V to 1.575 V to support low-power system architectures and mixed-voltage I/O schemes indicated by the IGLOO family.
- Low-Power Modes — Flash*Freeze technology enables ultra-low power retention (as low as 5 μW) and a Low Power Active option (from 12 μW) for power-conscious systems that must retain configuration and state.
- On-Chip Configuration and Security — Flash-based nonvolatile configuration with in-system programming support and family-level features such as on-chip AES decryption and FlashLock security mechanisms (as described for IGLOO devices).
- Clocking and Timing — Integrated clock conditioning resources including multiple CCC blocks with one block featuring a PLL (series-level capability described for IGLOO devices).
- Compliance and Grade — Commercial grade device with an operating temperature range of 0 °C to 70 °C and RoHS compliance for regulatory alignment.
Typical Applications
- Low-power embedded controllers — Implement control logic and peripheral interfaces while minimizing standby energy using Flash*Freeze and Low Power Active modes.
- Consumer electronics — Drive user interfaces, keypad scanning, and display control with instant-on capability and on-chip reprogrammable configuration.
- Portable and battery-powered instruments — Use compact LBGA packaging and low-voltage operation for space-constrained, energy-sensitive products.
- Secure configuration systems — Leverage flash-based nonvolatile configuration and the IGLOO family’s ISP and FlashLock features for protected device programming and content security.
Unique Advantages
- Ultra-low standby power: Flash*Freeze retains SRAM and register data while consuming as little as 5 μW, enabling aggressive power-management strategies.
- Reprogrammable flash configuration: Single-chip flash-based configuration provides instant-on behavior and removes the need for external configuration memory.
- Balanced logic and memory: 3,072 logic elements paired with approximately 36.9 kbits of embedded RAM supports diverse control and processing tasks without external RAM.
- Flexible I/O in a compact package: Ninety-seven user I/Os in a 144-LBGA (13×13) footprint supports mixed-signal interfacing while minimizing board area.
- Commercial-temperature suitability: Specified for 0 °C to 70 °C operation, matching typical consumer and commercial embedded product requirements.
Why Choose AGL125V2-FGG144?
The AGL125V2-FGG144 positions itself as a compact, low-power FPGA option within the Microchip IGLOO family for designers seeking reprogrammable logic with nonvolatile configuration and retained-state low-power modes. Its combination of moderate logic density, embedded RAM, and low-voltage operation makes it well suited for commercial embedded applications where board space, energy efficiency, and quick system wake are priorities.
Choose this part when you need a reliable, flash-based FPGA solution that simplifies BOM, provides secure in-system programming options, and supports scalable designs across a family of IGLOO devices.
Request a quote or submit a parts inquiry for AGL125V2-FGG144 to receive pricing, availability, and ordering information tailored to your project needs.

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