AGL125V2-FG144I

IC FPGA 97 I/O 144FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 97 36864 3072 144-LBGA

Quantity 944 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case144-LBGANumber of I/O97Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3072Number of Logic Elements/Cells3072
Number of Gates125000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of AGL125V2-FG144I – IGLOO FPGA, 3072 logic elements, 97 I/Os, 144-LBGA

The AGL125V2-FG144I is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 3,072 logic elements, embedded RAM, and 97 general-purpose I/Os in a compact 144-LBGA package intended for industrial-grade applications.

With a core supply range of 1.14 V to 1.575 V and an operating temperature span of −40 °C to 85 °C, this device targets designs that require moderate gate density, on-chip memory, and a small-footprint surface-mount package.

Key Features

  • Core Logic 3,072 logic elements (cells) providing programmable fabric for custom digital logic implementations.
  • Embedded Memory 36,864 bits of on-chip RAM (approximately 36.9 kbits) to support data buffering, state storage, and small lookup tables.
  • I/O Count 97 user I/Os for interfacing with peripherals, signals, and external devices.
  • Gate Capacity Approximately 125,000 gates of equivalent logic capacity for integrating moderate-complexity functions.
  • Power Core voltage supply range from 1.14 V to 1.575 V to match system power domains and optimize power consumption.
  • Package & Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13×13) with surface-mount construction for compact board-level integration.
  • Industrial Temperature Range Rated for operation from −40 °C to 85 °C to meet common industrial-environment requirements.
  • Regulatory Compliance RoHS compliant, supporting restricted-substance requirements in manufacturing and distribution.

Unique Advantages

  • Compact, high-density package: The 144-LBGA (144-FPBGA 13×13) footprint enables moderate logic and I/O capacity in a small board area.
  • Balanced logic and memory: 3,072 logic elements with 36,864 bits of embedded RAM supports a range of control and data-processing tasks without external memory.
  • Substantial I/O availability: 97 I/Os allow flexible interfacing to sensors, actuators, and auxiliary components while keeping system routing manageable.
  • Industrial-rated operation: −40 °C to 85 °C temperature range aligns the device with industrial-environment designs.
  • Low-voltage core operation: 1.14 V to 1.575 V supply range enables compatibility with modern low-voltage power architectures.
  • Regulatory readiness: RoHS compliance supports global manufacturing and environmental requirements.

Why Choose AGL125V2-FG144I?

The AGL125V2-FG144I delivers a practical combination of logic density, embedded memory, and I/O resources in a compact industrial-grade BGA package. Its specified operating temperature range and RoHS compliance make it suitable for designs that require reliability across typical industrial conditions while maintaining a small PCB footprint.

This IGLOO FPGA is appropriate for engineers and procurement teams seeking a mid-range programmable device from Microchip Technology that balances on-chip resources and package density for control, interfacing, and custom-logic functions.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the AGL125V2-FG144I.

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