AGL125V2-CS196I

IC FPGA 133 I/O 196CSP
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 133 36864 3072 196-TFBGA, CSBGA

Quantity 1,414 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package196-CSP (8x8)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case196-TFBGA, CSBGANumber of I/O133Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3072Number of Logic Elements/Cells3072
Number of Gates125000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of AGL125V2-CS196I – IGLOO Field Programmable Gate Array (FPGA) IC

The AGL125V2-CS196I is an IGLOO family flash FPGA offering a compact, reprogrammable logic solution with low-power operation and industrial-grade temperature support. It combines 3,072 logic elements, 36,864 bits of embedded RAM, and 133 I/Os in a 196-TFBGA (CSBGA) package for space-constrained and power-sensitive designs.

Built on the IGLOO low-power flash FPGA architecture, the device targets applications that require instant-on behavior, retained configuration in power-off states, and flexible I/O and clock management.

Key Features

  • Logic Density  3,072 logic elements (cells) and approximately 125,000 system gates provide a mid-range programmable fabric for control, glue-logic, and signal processing functions.
  • Embedded Memory  36,864 total RAM bits (approximately 0.037 Mbits) of on-chip SRAM for buffers, FIFOs, and small data stores.
  • I/O Capacity and Voltage Range  133 general-purpose I/Os with IGLOO family support for mixed-voltage operation; core and I/O voltage support spans 1.14 V to 1.575 V for the device core.
  • Low-Power Operation  IGLOO family Flash*Freeze and Low Power Active capabilities enable ultra-low-power retention modes (family figures include as low as 5 μW in Flash*Freeze and low micro-watt active idle behavior).
  • Nonvolatile Flash Configuration  Flash-based, reprogrammable configuration retains programmed design when powered off and supports in-system programming workflows.
  • Clocking and Timing  IGLOO family includes clock conditioning circuitry and PLL capabilities for flexible clock management and system timing (family-level CCC and PLL features).
  • Package and Temperature  Surface-mount 196-TFBGA (CSBGA) package, supplier device package listed as 196-CSP (8×8), and industrial operating temperature range of −40 °C to 85 °C.
  • Security and In-System Programming  IGLOO family supports in-system programming (ISP) with on-chip 128-bit AES decryption and FlashLock® security features (family-level capabilities; ARM-enabled IGLOO variants are noted exceptions).
  • Regulatory  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

  • Industrial Control  Logic consolidation, protocol bridging, and sensor interfacing in control systems that require industrial temperature operation and retained configuration.
  • Embedded System Glue Logic  Interface adaptation, bus bridging, and peripheral aggregation where compact package and flexible I/O voltage support simplify board design.
  • Low-Power Edge Devices  Battery-powered or energy-conscious systems that benefit from Flash*Freeze retention modes and low active idle power.
  • Communications and Networking  Control-plane functions, protocol adaptation, or timing control that leverage programmable logic and on-chip RAM for buffering and state storage.

Unique Advantages

  • Reprogrammable Nonvolatile Configuration: Retains programmed design when powered off, enabling instant-on behavior and simplified field updates.
  • Low-Power Retention and Idle Modes: Flash*Freeze and Low Power Active capabilities reduce system standby and scanning power, helping extend battery life or minimize system power consumption.
  • Balanced Logic and Memory: 3,072 logic elements paired with 36,864 bits of embedded RAM support a wide range of mid-density control and data-path functions without external memory.
  • Industrial Temperature Rating: −40 °C to 85 °C operation supports deployment in a broad set of industrial environments.
  • Compact Package: 196-TFBGA (CSBGA) footprint allows high-density PCB implementations while keeping I/O count and capability accessible.
  • Family-Level Programming and Security: IGLOO family ISP, AES decryption (family feature), and FlashLock® provide mechanisms for secure in-system updates and content protection.

Why Choose AGL125V2-CS196I?

The AGL125V2-CS196I positions itself as a practical, industrial-rated FPGA choice for engineers needing reprogrammable logic with low standby and active idle power characteristics. Its combination of 3,072 logic elements, embedded RAM, and 133 I/Os in a compact 196-TFBGA package makes it suitable for designs that require retained configuration, flexible I/O, and reliable operation across industrial temperature ranges.

For design teams focused on reducing board complexity and power consumption while maintaining in-field reprogrammability and security, this IGLOO device delivers family-proven low-power features and a flash-based architecture that supports rapid recovery from low-power modes and straightforward in-system programming workflows.

Request a quote or submit a pricing inquiry to confirm availability, lead times, and volume pricing for the AGL125V2-CS196I.

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