AGL250V5-FGG144I

The AGL250V5-FGG144I is a Microchip IGLOO low-power flash FPGA in a compact 144-LBGA package. It combines reprogrammable nonvolatile flash architecture with low-power operating modes and integrated clock-conditioning resources to address space- and power-constrained embedded designs.

With 6,144 logic elements, 36,864 bits of on-chip RAM and 97 user I/Os, this industrial-grade device is suited for applications that require mixed-voltage I/O support, secure in-system programming and robust thermal range (-40 °C to 85 °C).

Key Features

• Flash-based FPGA architecture Reprogrammable nonvolatile flash technology preserves the programmed design when powered off and enables instant-on operation.
• Logic and memory 6,144 logic elements and 36,864 bits of embedded RAM provide on-chip resources for mid-density logic integration.
• Low-power operation Flash*Freeze ultra-low-power retention mode down to 5 μW and Low Power Active operation from 12 μW simplify power-managed designs.
• Core voltage Core supply range specified at 1.425 V to 1.575 V for stable, single-voltage system operation.
• I/O capability 97 user I/Os with DDR and LVDS-capable interfaces (AGL250 and above), and bank-selectable mixed-voltage I/O support for flexible interfacing.
• Clock conditioning and PLL Integrated clock conditioning circuitry with up to six CCC blocks and one CCC including a PLL for clock multiplication, division and phase control.
• Performance Series performance levels include up to 250 MHz system operation at 1.5 V systems.
• Security and in-system programming In-system programming with on-chip 128-bit AES decryption (JTAG, IEEE 1532 compliant) and FlashLock® security features to protect FPGA contents.
• Package and temperature Surface-mount 144-LBGA (supplier package: 144-FPBGA 13×13) and industrial operating temperature range of −40 °C to 85 °C. RoHS compliant.

Typical Applications

• Industrial control Leverages industrial temperature rating and mixed-voltage I/Os for sensor interfacing, motor control logic and machine control subsystems.
• Interface bridging DDR- and LVDS-capable I/Os plus bank-selectable voltages allow protocol translation and high-speed I/O bridging between system domains.
• Low-power handheld and portable devices Flash*Freeze and Low Power Active modes enable local control functions and wake-on-event behavior while minimizing standby energy.
• User interface and system management On-chip nonvolatile configuration and instant-on capability are useful for control of displays, keypad scanning and power-management tasks.

Unique Advantages

• Nonvolatile, instant-on solution: Reprogrammable flash fabric retains design without external configuration memory, simplifying system boot and security.
• Ultra-low standby power: Flash*Freeze retention mode consumes as little as 5 μW, enabling extended battery life or low-power always-on functions.
• Flexible mixed-voltage I/O: Bank-selectable I/O voltages and DDR/LVDS-capable interfaces allow direct connection to diverse peripherals and buses.
• On-chip clock conditioning: Multiple CCC blocks and an integrated PLL reduce external clocking components and simplify timing management.
• Industrial-ready packaging and range: 144-LBGA surface-mount package with −40 °C to 85 °C rating supports deployment in industrial environments.
• Secure in-system updates: On-chip 128-bit AES decryption and FlashLock features enable secure JTAG-based programming and field updates.

Why Choose AGL250V5-FGG144I?

The AGL250V5-FGG144I positions itself as a compact, mid-density IGLOO FPGA option for designs that need a balance of logic capacity, embedded RAM and advanced low-power modes. Its flash-based nonvolatile architecture and secure ISP support simplify system design by removing the need for external configuration memory while enabling field reprogramming.

This industrial-grade device is well suited to engineers building mixed-voltage, low-power embedded systems that require deterministic boot behavior, flexible I/O options and integrated clocking. Its combination of logic resources, on-chip memory and security features delivers long-term value through reduced BOM complexity and simplified power and configuration management.

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