AGL250V5-CSG196I

The AGL250V5-CSG196I is a Microchip Technology IGLOO flash FPGA in a compact 196‑TFBGA (CSBGA) package. It combines reprogrammable flash-based FPGA fabric with on-chip SRAM and advanced I/O support to address low-power, space-constrained system designs.

Built for industrial-temperature operation and surface-mount assembly, this device is optimized for applications that require instant-on behavior, low standby power, and a mix of high-speed and mixed-voltage I/O capabilities.

Key Features

• Programmable Logic: 6,144 logic elements (cells) providing configurable logic capacity for glue logic, protocol handling, and custom control functions.
• Embedded Memory: Approximately 36.9 kbits of on-chip RAM (36,864 total RAM bits) for buffering, small data tables, and user registers.
• System Gates: Approximately 250,000 system gates for implementing medium-density FPGA designs.
• I/O Density and Standards: 143 I/O pins with support for high-speed DDR (700 Mbps) and LVDS-capable interfaces (AGL250 and above), and mixed-voltage operation across 1.2V, 1.5V, 1.8V, 2.5V and 3.3V domains as described for the IGLOO series.
• Low-Power Modes: Flash*Freeze ultra-low-power mode (as low as 5 μW) and Low Power Active (static idle) capability, enabling minimal standby consumption while retaining FPGA content and operational control.
• Flash-Based Nonvolatile Storage: Reprogrammable flash fabric that retains configuration when powered off and supports instant-on behavior; series devices include on-chip FlashROM storage.
• Clock Conditioning and PLL: Integrated clock conditioning circuitry in the IGLOO family, including CCC blocks and at least one PLL block for clock multiply/divide and phase adjustments (series feature).
• Power and Temperature: Core supply range 1.425 V to 1.575 V and industrial operating temperature range −40 °C to 85 °C.
• Package and Mounting: 196‑TFBGA (CSBGA) package, supplier package 196‑CSP (8×8), surface-mount for compact board-level integration.
• Environmental Compliance: RoHS compliant.

Typical Applications

• Power-Managed Embedded Systems: Use the Flash*Freeze and Low Power Active modes to implement system-level power management and instant-on control without high standby current.
• High-Speed I/O Bridging: Implement DDR and LVDS-capable interfaces and mixed-voltage I/O banks for protocol translation and high-speed interface logic.
• Compact Board-Level FPGA: The 196‑TFBGA package and surface-mount form factor suit space-constrained designs requiring reprogrammable logic and moderate I/O counts.
• Industrial Control and Monitoring: Industrial-grade temperature range and deterministic reprogrammable logic make this device suitable for control, sequencing, and interface tasks in industrial equipment.

Unique Advantages

• Low Standby Power: Flash*Freeze and Low Power Active modes enable extremely low-power retention (down to 5 μW), reducing system power budgets during idle periods.
• Nonvolatile Reprogrammability: Flash-based configuration retains the programmed design when powered off, enabling instant-on behavior and field reprogramming.
• Mixed-Voltage I/O Flexibility: Support for multiple I/O voltage domains and high-speed signaling lets you interface with a wide range of peripherals without external level-shifting.
• Industrial Temperature Rating: −40 °C to 85 °C operation aligns with industrial deployment requirements for reliable field use.
• Compact BGA Footprint: 196-ball BGA package provides a high-density, surface-mount solution for compact PCB layouts while preserving abundant I/O.
• Integrated Clocking Resources: On-device clock conditioning and PLL resources simplify system clock generation and timing management for complex logic designs.

Why Choose AGL250V5-CSG196I?

The AGL250V5-CSG196I brings together reprogrammable flash FPGA fabric, embedded SRAM, high-speed mixed-voltage I/O, and industry-grade thermal performance in a compact 196‑TFBGA package. Its low-power modes and nonvolatile configuration make it a strong fit for designs that require instant-on capability and minimized standby consumption while retaining flexibility for iterative development and field updates.

This device suits engineers building mid-density logic, interface bridging, and industrial control solutions that demand reliable operation across −40 °C to 85 °C, flexible I/O standards, and a small PCB footprint backed by Microchip’s IGLOO family architecture.

Request a quote or submit a quotation request to evaluate availability and pricing for the AGL250V5-CSG196I for your next design.