AGL250V5-CS196I
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 143 36864 6144 196-TFBGA, CSBGA |
|---|---|
| Quantity | 158 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 196-CSP (8x8) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 196-TFBGA, CSBGA | Number of I/O | 143 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of AGL250V5-CS196I – IGLOO Low-Power Flash FPGA, 196-TFBGA (Industrial)
The AGL250V5-CS196I is an IGLOO family flash-based Field Programmable Gate Array (FPGA) in a 196-TFBGA / CSBGA package targeted for industrial applications. It combines reprogrammable flash nonvolatile configuration with low-power operating modes and a compact surface-mount package for space-constrained designs.
This device delivers 6,144 logic elements, approximately 36.9 kbits of embedded RAM, 143 user I/Os and around 250,000 gates, making it suitable for low-power embedded and industrial control designs that require nonvolatile configuration and flexible I/O options.
Key Features
- Logic Capacity — 6,144 logic elements (cells) and approximately 250,000 system gates provide mid-range programmable logic for control, glue-logic and integration tasks.
- Embedded Memory — Total on-chip RAM: 36,864 bits (approximately 36.9 kbits) for register files, FIFOs and small buffering requirements.
- I/O Resources — 143 user I/Os with mixed-voltage support across banks; differential and DDR-capable I/Os are supported at AGL250 and above per family specifications.
- Low-Power Technology — IGLOO family Flash*Freeze and Low Power Active capabilities provide ultra-low power retention modes (Flash*Freeze down to 5 μW and low-power active operation from 12 μW as described for the IGLOO family).
- Reprogrammable Flash Configuration — Flash-based nonvolatile configuration retains programmed design when powered off and supports in-system programming with on-chip 128-bit AES decryption (family-level feature).
- Clocking and PLL — Family clock-conditioning circuitry and integrated PLL options enable configurable phase shift and multiply/divide functions (per IGLOO family documentation).
- Power and Thermal — Core supply specified at 1.425 V to 1.575 V; operating temperature range –40 °C to 85 °C for industrial-grade deployments.
- Package and Assembly — Surface-mount 196-TFBGA / CSBGA package (supplier device package: 196-CSP 8×8) for compact PCB footprints and automated assembly.
- Standards and Compliance — RoHS compliant.
Typical Applications
- Industrial Control — Use for mid-density programmable logic, sensor interfacing, and local control functions where industrial temperature range and nonvolatile configuration are required.
- Low-Power Embedded Systems — Ideal for designs that need ultra-low-power retention modes and instant-on behavior while maintaining system state.
- I/O Bridging and Protocol Conversion — Fits applications that require flexible mixed-voltage I/O and DDR/differential signaling at the AGL250 feature level.
- Power Management and System Supervision — Suitable for controllers that manage system power states and require low-power background scanning or monitoring.
Unique Advantages
- Nonvolatile, Reprogrammable Configuration: Flash-based configuration keeps device contents when power is removed and supports in-system programming with AES decryption at the family level, simplifying field updates.
- Low Standby and Active Power: Flash*Freeze and Low Power Active modes reduce standby and idle power draw, enabling energy-efficient system designs.
- Compact, Surface-Mount Package: 196-TFBGA package offers a small PCB footprint for space-constrained industrial and embedded boards.
- Balanced Logic and Memory Resources: 6,144 logic elements and approximately 36.9 kbits of RAM provide a practical midpoint of capacity for integration of control and buffering functions without external memory.
- Industrial Temperature Rating: Specified operation from –40 °C to 85 °C supports deployment in typical industrial environments.
Why Choose AGL250V5-CS196I?
The AGL250V5-CS196I positions itself as a mid-capacity, industrial-grade IGLOO flash FPGA that combines nonvolatile reprogrammability with low-power modes and flexible I/O. Its balance of logic elements, on-chip RAM and user I/Os makes it appropriate for embedded and industrial applications that need a compact, reliable programmable solution.
For teams seeking a single-chip programmable device with flash-based configuration retention, low standby operation, and a compact surface-mount package, the AGL250V5-CS196I offers a practical, verifiable option aligned with IGLOO family capabilities and industrial temperature requirements.
Request a quote or submit an inquiry to get pricing, lead times and support for integrating the AGL250V5-CS196I into your next design.

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