AGL250V5-CS196I

IC FPGA 143 I/O 196CSP
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 143 36864 6144 196-TFBGA, CSBGA

Quantity 158 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package196-CSP (8x8)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case196-TFBGA, CSBGANumber of I/O143Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of AGL250V5-CS196I – IGLOO Low-Power Flash FPGA, 196-TFBGA (Industrial)

The AGL250V5-CS196I is an IGLOO family flash-based Field Programmable Gate Array (FPGA) in a 196-TFBGA / CSBGA package targeted for industrial applications. It combines reprogrammable flash nonvolatile configuration with low-power operating modes and a compact surface-mount package for space-constrained designs.

This device delivers 6,144 logic elements, approximately 36.9 kbits of embedded RAM, 143 user I/Os and around 250,000 gates, making it suitable for low-power embedded and industrial control designs that require nonvolatile configuration and flexible I/O options.

Key Features

  • Logic Capacity — 6,144 logic elements (cells) and approximately 250,000 system gates provide mid-range programmable logic for control, glue-logic and integration tasks.
  • Embedded Memory — Total on-chip RAM: 36,864 bits (approximately 36.9 kbits) for register files, FIFOs and small buffering requirements.
  • I/O Resources — 143 user I/Os with mixed-voltage support across banks; differential and DDR-capable I/Os are supported at AGL250 and above per family specifications.
  • Low-Power Technology — IGLOO family Flash*Freeze and Low Power Active capabilities provide ultra-low power retention modes (Flash*Freeze down to 5 μW and low-power active operation from 12 μW as described for the IGLOO family).
  • Reprogrammable Flash Configuration — Flash-based nonvolatile configuration retains programmed design when powered off and supports in-system programming with on-chip 128-bit AES decryption (family-level feature).
  • Clocking and PLL — Family clock-conditioning circuitry and integrated PLL options enable configurable phase shift and multiply/divide functions (per IGLOO family documentation).
  • Power and Thermal — Core supply specified at 1.425 V to 1.575 V; operating temperature range –40 °C to 85 °C for industrial-grade deployments.
  • Package and Assembly — Surface-mount 196-TFBGA / CSBGA package (supplier device package: 196-CSP 8×8) for compact PCB footprints and automated assembly.
  • Standards and Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — Use for mid-density programmable logic, sensor interfacing, and local control functions where industrial temperature range and nonvolatile configuration are required.
  • Low-Power Embedded Systems — Ideal for designs that need ultra-low-power retention modes and instant-on behavior while maintaining system state.
  • I/O Bridging and Protocol Conversion — Fits applications that require flexible mixed-voltage I/O and DDR/differential signaling at the AGL250 feature level.
  • Power Management and System Supervision — Suitable for controllers that manage system power states and require low-power background scanning or monitoring.

Unique Advantages

  • Nonvolatile, Reprogrammable Configuration: Flash-based configuration keeps device contents when power is removed and supports in-system programming with AES decryption at the family level, simplifying field updates.
  • Low Standby and Active Power: Flash*Freeze and Low Power Active modes reduce standby and idle power draw, enabling energy-efficient system designs.
  • Compact, Surface-Mount Package: 196-TFBGA package offers a small PCB footprint for space-constrained industrial and embedded boards.
  • Balanced Logic and Memory Resources: 6,144 logic elements and approximately 36.9 kbits of RAM provide a practical midpoint of capacity for integration of control and buffering functions without external memory.
  • Industrial Temperature Rating: Specified operation from –40 °C to 85 °C supports deployment in typical industrial environments.

Why Choose AGL250V5-CS196I?

The AGL250V5-CS196I positions itself as a mid-capacity, industrial-grade IGLOO flash FPGA that combines nonvolatile reprogrammability with low-power modes and flexible I/O. Its balance of logic elements, on-chip RAM and user I/Os makes it appropriate for embedded and industrial applications that need a compact, reliable programmable solution.

For teams seeking a single-chip programmable device with flash-based configuration retention, low standby operation, and a compact surface-mount package, the AGL250V5-CS196I offers a practical, verifiable option aligned with IGLOO family capabilities and industrial temperature requirements.

Request a quote or submit an inquiry to get pricing, lead times and support for integrating the AGL250V5-CS196I into your next design.

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