AGLN125V5-CSG81

IC FPGA 60 I/O 81CSP
Part Description

IGLOO nano Field Programmable Gate Array (FPGA) IC 60 36864 3072 81-WFBGA, CSBGA

Quantity 985 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package81-CSP (5x5)GradeCommercialOperating Temperature-20°C – 85°C
Package / Case81-WFBGA, CSBGANumber of I/O60Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3072Number of Logic Elements/Cells3072
Number of Gates125000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of AGLN125V5-CSG81 – IGLOO nano Field Programmable Gate Array (FPGA) IC, 60 I/O, ~36,864-bit RAM, 3,072 logic elements, 81-WFBGA

The AGLN125V5-CSG81 is an IGLOO nano Field Programmable Gate Array (FPGA) designed for compact, programmable digital logic implementations. It provides a fixed set of on-chip resources—3,072 logic elements, approximately 36,864 bits of embedded RAM and 60 I/O pins—in an 81-WFBGA (CSBGA) package suitable for surface-mount assembly.

This device is positioned for commercial-grade FPGA-based designs that require a small package footprint, predictable supply requirements, and moderate capacity for custom logic and memory integration.

Key Features

  • Core Logic  3,072 logic elements (LEs) providing the programmable fabric for implementing custom digital functions and control logic.
  • Embedded Memory  Approximately 36,864 bits of on-chip RAM for local data buffering, small FIFOs, and state storage within logic designs.
  • I/O Capacity  60 general-purpose I/O pins to connect sensors, peripherals, buses or external devices directly to the FPGA fabric.
  • Gate Equivalent  Equivalent to 125,000 gates, enabling mid-range combinational and sequential logic implementations.
  • Power Supply  Operates from a dedicated core voltage range of 1.425 V to 1.575 V for stable and predictable power planning.
  • Package and Mounting  81-WFBGA (CSBGA) package in an 81-CSP (5×5) supplier device footprint, optimized for surface-mount manufacturing and compact board layouts.
  • Operating Temperature  Rated for commercial operation from -20 °C to 85 °C to match typical ambient conditions for commercial electronic products.
  • Regulatory  RoHS compliant, supporting lead-free manufacturing and environmental compliance requirements.
  • Grade  Commercial grade device appropriate for a wide range of consumer and industrial-adjacent electronic applications.

Typical Applications

  • Embedded Control and Glue Logic  Implement custom control state machines, bus interfacing, and glue logic where a compact FPGA with moderate resources is required.
  • Sensor and Peripheral Interfacing  Aggregate and preprocess signals from sensors or peripherals using on-chip logic and local RAM for buffering.
  • Protocol Bridging and I/O Expansion  Bridge between different serial/parallel interfaces or expand microcontroller I/O using programmable logic and 60 available I/Os.
  • Prototyping and Low-Volume Production  Small-package FPGA suitable for prototypes and commercial products that need reprogrammable logic without large device footprints.

Unique Advantages

  • Compact, high-density package: 81-WFBGA/81-CSP (5×5) footprint enables integration into space-constrained PCBs while retaining useful logic and I/O capacity.
  • Balanced on-chip resources: The combination of 3,072 logic elements and ~36,864 bits of RAM supports a range of mid-scale logic and buffering tasks without external memory.
  • Predictable power requirements: Narrow core voltage range (1.425 V–1.575 V) simplifies power supply design and margining for the core rail.
  • Commercial temperature rating: Operation from -20 °C to 85 °C covers common commercial environments for deployed electronic products.
  • RoHS compliant: Supports lead-free, environmentally conscious manufacturing processes.
  • Surface-mount friendly: CSP/WFBGA packaging supports automated assembly and compact board-level integration.

Why Choose AGLN125V5-CSG81?

The AGLN125V5-CSG81 provides a straightforward, compact FPGA option for designers who need a mid-range programmable logic device with a clear set of on-chip resources. With 3,072 logic elements, approximately 36,864 bits of embedded RAM, 60 I/Os and an 81-WFBGA package, it is well suited to designs that demand a small footprint and reliable, repeatable electrical characteristics.

This device is ideal for engineering teams working on commercial electronic products that require deterministic supply rails, surface-mount packaging, and RoHS compliance. It offers a practical balance of logic density, memory, and I/O for integrating custom digital functions directly into compact boards.

Request a quote or submit a purchasing inquiry for AGLN125V5-CSG81 to evaluate its fit in your next FPGA-based design.

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