APA075-FGG144I

IC FPGA 100 I/O 144FBGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 100 27648 144-LBGA

Quantity 957 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case144-LBGANumber of I/O100Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3072Number of Logic Elements/Cells3072
Number of Gates75000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits27648

Overview of APA075-FGG144I – ProASICPLUS Field Programmable Gate Array (FPGA), 100 I/Os, 3,072 Logic Elements, 144-LBGA

The APA075-FGG144I is a ProASICPLUS Field Programmable Gate Array (FPGA) IC providing a mid-range programmable logic solution with 3,072 logic elements (3072 CLBs) and approximately 75,000 gates. Its combination of on-chip memory, 100 I/Os and a compact 144-LBGA package makes it suitable for industrial applications that require reconfigurable logic with constrained board space and defined environmental limits.

Key Features

  • Core Logic 3,072 logic elements (3072 CLBs) delivering approximately 75,000 gates of programmable logic capacity for moderate-complexity designs.
  • Embedded Memory Total on-chip RAM of 27,648 bits — approximately 0.0276 Mbits — for small data buffering and control state storage.
  • I/O 100 general-purpose I/Os to interface with sensors, peripherals and external logic.
  • Power Low-voltage operation with a supply range of 2.3 V to 2.7 V to match system power rails.
  • Package & Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB integration.
  • Industrial Temperature Rated for operation from –40°C to 85°C and marked as Industrial grade for use in industrial environments.
  • Regulatory Compliance RoHS compliant to support lead-free assembly and regulatory requirements.

Typical Applications

  • Industrial Control & Automation — Use programmable logic and 100 I/Os for glue logic, peripheral interfacing and custom control functions in factory or process equipment.
  • Embedded Systems & Prototyping — Implement custom state machines and interface logic where moderate logic density and on-chip memory are sufficient for validation and early product development.
  • Communications & Protocol Bridging — Provide protocol conversion, I/O adaptation, and timing control between subsystems using the available I/O count and programmable logic.
  • Test & Measurement — Integrate custom signal routing, triggering logic and peripheral control functions within compact instrumentation designs.

Unique Advantages

  • Balanced Logic Capacity: 3,072 logic elements and ~75,000 gates provide a practical balance between capability and cost for mid-range applications.
  • Compact, PCB-Friendly Package: 144-LBGA (144-FPBGA, 13×13) surface-mount package enables high-density board layouts while keeping package footprint predictable.
  • Broad I/O Count: 100 I/Os support multiple peripheral connections without external I/O expanders, simplifying BOM and board routing.
  • Low-Voltage Compatibility: 2.3 V to 2.7 V supply range fits systems designed around modern low-voltage rails.
  • Industrial Temperature Rating: –40°C to 85°C operating range supports deployment in industrial environments where temperature resilience is required.
  • RoHS Compliant: Meets lead-free assembly requirements for modern manufacturing workflows.

Why Choose APA075-FGG144I?

The APA075-FGG144I positions itself as a practical, industrial-grade FPGA option for designs that need moderate programmable logic capacity, a solid I/O complement and compact packaging. Its combination of 3,072 logic elements, approximately 27,648 bits of on-chip RAM and 100 I/Os delivers the integration needed to reduce external components and simplify board-level design.

This device is well suited to engineers and procurement teams building industrial controls, embedded systems prototypes, communications interfaces and compact instrumentation. The industrial temperature range, RoHS compliance and small-footprint BGA package contribute to long-term robustness and predictable integration in volume production.

Request a quote or submit a pricing inquiry to check availability and receive tailored pricing information for the APA075-FGG144I for your next design.

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