APA075-PQG208
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 158 27648 208-BFQFP |
|---|---|
| Quantity | 342 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 158 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 75000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 27648 |
Overview of APA075-PQG208 – ProASICPLUS Field Programmable Gate Array (FPGA) IC 158 27648 208-BFQFP
The APA075-PQG208 is a ProASICPLUS field programmable gate array (FPGA) IC from Microchip Technology, delivered in a 208-BFQFP (208-PQFP, 28×28) surface-mount package. It provides a commercial-grade programmable logic solution with a balance of logic density, I/O capability and embedded memory for a range of embedded applications.
This device targets commercial embedded designs that require up to 158 I/O pins, approximately 0.028 Mbits of embedded memory, and 3072 logic elements (≈75,000 gates) while operating from a 2.3 V to 2.7 V supply within a 0 °C to 70 °C temperature range.
Key Features
- Logic Capacity Provides 3072 logic elements (approximately 75,000 gates) suitable for implementing custom digital functions and moderate-density logic integration.
- On-Chip Memory Approximately 0.028 Mbits (27,648 bits) of embedded RAM to support state storage, FIFOs or small buffering requirements.
- I/O and Connectivity Up to 158 user I/O pins to support multiple interfaces, bus bridging and peripheral control on a single device.
- Power and Supply Operates from a 2.3 V to 2.7 V supply rail for compatibility with low-voltage system power domains.
- Package and Mounting 208-BFQFP (208-PQFP, 28×28) surface-mount package for PCB-mounted commercial designs requiring a compact footprint.
- Operating Range and Grade Commercial-grade device rated for 0 °C to 70 °C operation.
- Regulatory RoHS compliant.
Typical Applications
- Embedded Control Use as programmable glue logic and control functions in commercial embedded systems leveraging 3072 logic elements and 158 I/O pins.
- Interface Bridging Implement protocol translation or bus interfacing where multiple I/O and modest on-chip RAM are required.
- Prototyping and Custom Logic Suitable for proof-of-concept and low- to mid-density custom logic implementations in a compact surface-mount package.
Unique Advantages
- Balanced Logic Density: 3072 logic elements (~75,000 gates) provide a practical level of integration for many commercial applications without excessive board-level complexity.
- Practical On-Chip Memory: Approximately 0.028 Mbits of embedded RAM supports buffering and small-state storage directly on the FPGA.
- High I/O Count: 158 I/O pins enable multiple peripheral connections and flexible interface implementations from a single device.
- Compact Surface-Mount Package: 208-BFQFP (28×28) delivers a space-efficient mount option for populated PCBs.
- Low-Voltage Operation: 2.3 V to 2.7 V supply range supports integration with common low-voltage system rails.
- RoHS Compliant: Helps meet environmental compliance requirements for commercial products.
Why Choose APA075-PQG208?
The APA075-PQG208 offers a commercial-grade FPGA option that combines moderate logic capacity, practical on-chip memory and a high I/O count in a compact 208-BFQFP surface-mount package. Its 2.3 V–2.7 V supply range and 0 °C–70 °C operating range make it suitable for a wide range of commercial embedded applications where programmable logic and interface flexibility are required.
As a Microchip Technology ProASICPLUS device, this part suits designers seeking a cost-effective, mid-density FPGA for glue logic, interface bridging, prototyping and other commercial embedded functions that benefit from integrated logic, memory and I/O in a single package.
Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the APA075-PQG208. Our team can provide a tailored response for volume requirements and delivery options.

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