APA075-PQG208I

The APA075-PQG208I is a ProASICPLUS field programmable gate array (FPGA) provided in a 208-pin BFQFP package. It delivers a mid-density programmable logic resource set with on-chip embedded memory and a broad I/O count for applications requiring configurable logic and interface connectivity.

With 3,072 logic elements, approximately 0.028 Mbits of embedded memory and 158 I/O, the device targets designs that require flexible logic implementation, memory buffering, and multiple external interfaces within an industrial-temperature, surface-mount package.

Key Features

• Core Logic – 3,072 logic elements (reported as logic element cells) and approximately 75,000 equivalent gates for mid-density programmable logic implementations.
• Embedded Memory – 27,648 bits of on-chip RAM (approximately 0.028 Mbits) to support small buffers, state machines and temporary data storage within the FPGA fabric.
• I/O Resources – 158 general-purpose I/O pins to support multiple external interfaces and peripheral connections.
• Power Supply – Operates from a 2.3 V to 2.7 V supply range, enabling designs that use lower-voltage logic domains.
• Package & Mounting – Supplied in a 208-BFQFP surface-mount package (supplier device package: 208-PQFP, 28×28), suitable for compact PCB layouts.
• Industrial Temperature Grade – Rated for operation from −40 °C to 85 °C for deployment in industrial environments.
• Regulatory – RoHS compliant.

Typical Applications

• Interface and Bridging – Use the device to implement protocol bridging and interface aggregation where a mid-range number of I/O and on-chip logic are required.
• Embedded Control – Implement control logic, state machines, and glue logic for industrial equipment within the specified industrial temperature range.
• Peripheral Aggregation – Consolidate multiple peripheral signals and simple data buffering using the available I/O and embedded RAM.

Unique Advantages

• Balanced Logic and Memory: 3,072 logic elements combined with 27,648 bits of RAM provide a balance of programmable logic and on-chip memory for mid-density designs.
• Generous I/O Count: 158 I/O pins allow for flexible external connectivity without immediate need for external I/O expanders.
• Industrial Temperature Support: −40 °C to 85 °C rating enables deployment in industrial-grade applications.
• Compact Surface-Mount Package: 208-BFQFP (208-PQFP, 28×28) offers a compact footprint for space-constrained PCB designs.
• Low-Voltage Operation: 2.3 V to 2.7 V supply compatibility supports integration with lower-voltage system domains.
• RoHS Compliant: Meets RoHS requirements for lead-free assembly and regulatory compliance in applicable regions.

Why Choose APA075-PQG208I?

The APA075-PQG208I positions itself as a mid-density ProASICPLUS FPGA option for engineers seeking a combination of programmable logic, embedded memory, and a substantial I/O count in a compact surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for long-life, industrial designs that require on-board configurability and interface flexibility.

This device is well suited to teams implementing control logic, interface bridging, or peripheral aggregation where a reliable, lower-voltage FPGA solution with on-chip RAM and a high I/O count is required. Its combination of logic elements, RAM, and package options supports scalable designs and simplifies board-level integration.

If you would like pricing, availability, or to request a quote for APA075-PQG208I, submit an inquiry or request a quote through your preferred purchasing channel. Representatives will respond with detailed ordering and availability information.